Matthew E. Souter

Person

Tustin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate including selectively formed barrier layer
- Patent number 9,754,823
- Issue date Sep 5, 2017
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate including selectively formed barrier layer
- Patent number 9,748,135
- Issue date Aug 29, 2017
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser removal of conductive seed layers
- Patent number 9,132,511
- Issue date Sep 15, 2015
- SUSS MICROTEC PHOTONIC SYSTEMS, INC.
- Matthew E. Souter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser removal of conductive seed layers
- Patent number 8,778,799
- Issue date Jul 15, 2014
- Tamarack Scientific Co. Inc.
- Matthew E. Souter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20180082965
- Publication date Mar 22, 2018
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20180076160
- Publication date Mar 15, 2018
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20170117241
- Publication date Apr 27, 2017
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER
- Publication number 20160204028
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION SYSTEM INCLUDING VARIABLE ENERGY BEAM TO MINIMIZE ET...
- Publication number 20160184926
- Publication date Jun 30, 2016
- SUSS MicroTec Photonic Systems Inc.
- Courtney T. Sheets
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER ETCHING SYSTEM INCLUDING MASK RETICLE FOR MULTI-DEPTH ETCHING
- Publication number 20160074968
- Publication date Mar 17, 2016
- SUSS MicroTec Photonic Systems Inc.
- Matthew E. Souter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER
- Publication number 20150357235
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER
- Publication number 20150348831
- Publication date Dec 3, 2015
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER REMOVAL OF CONDUCTIVE SEED LAYERS
- Publication number 20150014287
- Publication date Jan 15, 2015
- Tamarack Scientific Co. Inc.
- Matthew E. Souter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER REMOVAL OF CONDUCTIVE SEED LAYERS
- Publication number 20120184099
- Publication date Jul 19, 2012
- Tamarack Scientific Co. Inc.
- Matthew E. Souter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Matthew E. Souter

Person

Patents Grantslast 30 patents

Substrate including selectively formed barrier layer

Substrate including selectively formed barrier layer

Laser removal of conductive seed layers

Laser removal of conductive seed layers

Patents Applicationslast 30 patents

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER

LASER ABLATION SYSTEM INCLUDING VARIABLE ENERGY BEAM TO MINIMIZE ET...

LASER ETCHING SYSTEM INCLUDING MASK RETICLE FOR MULTI-DEPTH ETCHING

SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER

SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER

LASER REMOVAL OF CONDUCTIVE SEED LAYERS

LASER REMOVAL OF CONDUCTIVE SEED LAYERS