Matthew F. Seward

Person

Windsor, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus to establish circuit layers interconnections
- Patent number 6,982,387
- Issue date Jan 3, 2006
- International Business Machines Corporation
- Richard R. Hall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered high density connections
- Patent number 6,721,187
- Issue date Apr 13, 2004
- International Business Machines Corporation
- Richard Ronald Hall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid conductive element insertion apparatus
- Patent number 6,712,261
- Issue date Mar 30, 2004
- International Business Machines Corporation
- Richard R. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for determining the location of a short in an...
- Patent number 6,651,013
- Issue date Nov 18, 2003
- International Business Machines Corporation
- How T. Lin
- G01 - MEASURING TESTING
Information Patent Grant
Probe for testing and repairing printed circuit features
- Patent number 6,369,592
- Issue date Apr 9, 2002
- International Business Machines Corporation
- Christopher J. Majka
- G01 - MEASURING TESTING
Information Patent Grant
Automated inspection system for metallic surfaces
- Patent number 6,198,529
- Issue date Mar 6, 2001
- International Business Machines Corporation
- John C. Clark
- G01 - MEASURING TESTING
Information Patent Grant
Process and apparatus for the capacitive testing of printed circuits
- Patent number 6,005,394
- Issue date Dec 21, 1999
- International Business Machines Corporation
- Christopher J. Majka
- G01 - MEASURING TESTING
Information Patent Grant
High speed shunt regulator
- Patent number 5,554,924
- Issue date Sep 10, 1996
- International Business Machines Corporation
- Jerry K. McMahon
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
Solid conductive element insertion apparatus
- Publication number 20030178471
- Publication date Sep 25, 2003
- International Business Machines Corporation
- Richard R. Hall
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus to establish circuit layers interconnections
- Publication number 20020189861
- Publication date Dec 19, 2002
- International Business Machines Corporation
- Richard R. Hall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-layered high density connections
- Publication number 20020131252
- Publication date Sep 19, 2002
- International Business Machines Corporation
- Richard Ronald Hall
- H01 - BASIC ELECTRIC ELEMENTS

Matthew F. Seward

Person

Patents Grantslast 30 patents

Method and apparatus to establish circuit layers interconnections

Multi-layered high density connections

Solid conductive element insertion apparatus

Method and apparatus for determining the location of a short in an...

Probe for testing and repairing printed circuit features

Automated inspection system for metallic surfaces

Process and apparatus for the capacitive testing of printed circuits

High speed shunt regulator

Patents Applicationslast 30 patents

Solid conductive element insertion apparatus

Method and apparatus to establish circuit layers interconnections

Multi-layered high density connections