Matthew Herset

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Kalispell, MT, US

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Patents Grantslast 30 patents

Information Patent Grant
Deplating contacts in an electrochemical plating apparatus
- Patent number 8,500,968
- Issue date Aug 6, 2013
- Applied Materials, Inc.
- Daniel J. Woodruff
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR