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Matthew J. Zapico
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Cedar Park, TX, US
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Patents Grants
last 30 patents
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Patent Grant
Copper ball bond interface structure and formation
Patent number
9,257,403
Issue date
Feb 9, 2016
FREESCALE SEMICONDUCTOR, INC.
Tu-Anh N. Tran
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
METHOD FOR MAKING A SEMICONDUCTOR DEVICE HAVING AN INTERPOSER
Publication number
20170047271
Publication date
Feb 16, 2017
FREESCALE SEMICONDUCTOR, INC.
MATTHEW J. ZAPICO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Copper Ball Bond Interface Structure and Formation
Publication number
20150145148
Publication date
May 28, 2015
FREESCALE SEMICONDUCTOR, INC.
Tu-Anh N. Tran
H01 - BASIC ELECTRIC ELEMENTS