Matthew L. Tingey

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Airgap structures for high speed signal integrity
- Patent number 12,255,130
- Issue date Mar 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled inductor with small form factor
- Patent number 12,224,103
- Issue date Feb 11, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable die attach materials and processes for patterning
- Patent number 11,923,312
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 11,817,349
- Issue date Nov 14, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 11,676,891
- Issue date Jun 13, 2023
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 11,088,062
- Issue date Aug 10, 2021
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double patterning lithography techniques
- Patent number 9,142,421
- Issue date Sep 22, 2015
- Intel Corporation
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned nanowires
- Patent number 8,409,690
- Issue date Apr 2, 2013
- Intel Corporation
- Charles H. Wallace
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Illumination aperture for optical lithography
- Patent number 8,233,210
- Issue date Jul 31, 2012
- Intel Corporation
- Charles Wallace
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Double patterning techniques and structures
- Patent number 7,915,171
- Issue date Mar 29, 2011
- Intel Corporation
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20250149433
- Publication date May 8, 2025
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Publication number 20250112124
- Publication date Apr 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND METHODS FOR SURFACE LEVELING
- Publication number 20240282591
- Publication date Aug 22, 2024
- Intel Corporation
- Oladeji FADAYOMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER...
- Publication number 20240222249
- Publication date Jul 4, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES
- Publication number 20240222137
- Publication date Jul 4, 2024
- Intel Corporation
- Shaojiang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY FILM PHOTORESIST WET LAMINATION AND METHOD
- Publication number 20240203853
- Publication date Jun 20, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20240088052
- Publication date Mar 14, 2024
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20230022714
- Publication date Jan 26, 2023
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANGLED INDUCTOR WITH SMALL FORM FACTOR
- Publication number 20220399150
- Publication date Dec 15, 2022
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIRGAP STRUCTURES FOR HIGH SPEED SIGNAL INTEGRITY
- Publication number 20210375746
- Publication date Dec 2, 2021
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20210327800
- Publication date Oct 21, 2021
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE DRY FILM RESIST FOR PHOTOLITHOGRAPHY
- Publication number 20210318612
- Publication date Oct 14, 2021
- Intel Corporation
- Hongxia FENG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CONDUCTIVE ROUTE PATTERNING FOR ELECTRONIC SUBSTRATES
- Publication number 20210280463
- Publication date Sep 9, 2021
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20200312771
- Publication date Oct 1, 2020
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20190027431
- Publication date Jan 24, 2019
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE PATTERNING LITHOGRAPHY TECHNIQUES
- Publication number 20140017899
- Publication date Jan 16, 2014
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED NANOWIRES
- Publication number 20110274882
- Publication date Nov 10, 2011
- Charles H. Wallace
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Illumination aperture for optical lithography
- Publication number 20100165317
- Publication date Jul 1, 2010
- Charles Wallace
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DOUBLE PATTERNING TECHNIQUES AND STRUCTURES
- Publication number 20090267175
- Publication date Oct 29, 2009
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS

Matthew L. Tingey

Person

Patents Grantslast 30 patents

Airgap structures for high speed signal integrity

Method to enable 30 microns pitch EMIB or below

Angled inductor with small form factor

Patternable die attach materials and processes for patterning

Conductive route patterning for electronic substrates

Method to enable 30 microns pitch EMIB or below

Method to enable 30 microns pitch EMIB or below

Double patterning lithography techniques

Patterned nanowires

Illumination aperture for optical lithography

Double patterning techniques and structures

Patents Applicationslast 30 patents

NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING

TOOLS AND METHODS FOR SURFACE LEVELING

INTEGRATED CIRCUIT DEVICE PACKAGE SUBSTRATES WITH GLASS CORE LAYER...

ENABLING COPPER RECESS FLATTENING THROUGH A DFR PATTERNING PROCESSES

DRY FILM PHOTORESIST WET LAMINATION AND METHOD

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

ANGLED INDUCTOR WITH SMALL FORM FACTOR

AIRGAP STRUCTURES FOR HIGH SPEED SIGNAL INTEGRITY

NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

COMPOSITE DRY FILM RESIST FOR PHOTOLITHOGRAPHY

CONDUCTIVE ROUTE PATTERNING FOR ELECTRONIC SUBSTRATES

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

DOUBLE PATTERNING LITHOGRAPHY TECHNIQUES

PATTERNED NANOWIRES

Illumination aperture for optical lithography

DOUBLE PATTERNING TECHNIQUES AND STRUCTURES