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Matthew M. Reiss
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Endwell, NY, US
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Patents Grants
last 30 patents
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Patent Grant
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
Patent number
6,989,607
Issue date
Jan 24, 2006
International Business Machines Corporation
Krishna Darbha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an apparatus to reduce thermal fatigue stress on...
Patent number
6,667,557
Issue date
Dec 23, 2003
International Business Machines Corporation
David J. Alcoe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
Patent number
6,639,302
Issue date
Oct 28, 2003
International Business Machines Corporation
Krishna Darbha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus to reduce thermal fatigue stress on flip chip solder conn...
Patent number
6,570,259
Issue date
May 27, 2003
International Business Machines Corporation
David J. Alcoe
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Stress reduction in flip-chip PBGA packaging by utilizing segmented...
Publication number
20040021205
Publication date
Feb 5, 2004
Krishna Darbha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING AN APPARATUS TO REDUCE THERMAL FATIGUE STRESS ON...
Publication number
20030210531
Publication date
Nov 13, 2003
David J. Alcoe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRESS REDUCTION IN FLIP-CHIP PBGA PACKAGING BY UTILIZING SEGMENTED...
Publication number
20030178649
Publication date
Sep 25, 2003
International Business Machines Corporation
Krishna Darbha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus to reduce thermal fatigue stress on flip chip solder conn...
Publication number
20020135063
Publication date
Sep 26, 2002
International Business Machines Corporation
David J. Alcoe
H01 - BASIC ELECTRIC ELEMENTS