Matthew Michael Day

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Newport, GB

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer dicing process
- Patent number 11,545,394
- Issue date Jan 3, 2023
- SPTS Technologies Limited
- Matthew Michael Day
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Reducing Substrate Thickness and Surface R...
- Publication number 20240128066
- Publication date Apr 18, 2024
- SPTS TECHNOLOGIES LIMITED
- Roland Mumford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer Dicing Process
- Publication number 20210183703
- Publication date Jun 17, 2021
- SPTS TECHNOLOGIES LIMITED
- Matthew Michael Day
- H01 - BASIC ELECTRIC ELEMENTS