Matthew Preston

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wirebond lead system with improved wire separation
- Patent number 5,530,281
- Issue date Jun 25, 1996
- VLSI Technology, Inc.
- Richard L. Groover
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly carrier
- Patent number 5,278,447
- Issue date Jan 11, 1994
- LSI Logic Corporation
- Sutee Vongfuangfoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CLEAR LAYER ISOLATION
- Publication number 20120290255
- Publication date Nov 15, 2012
- Intersil Americas Inc.
- Nikhil Vishwanath Kelkar
- H03 - BASIC ELECTRONIC CIRCUITRY