Matthew R. Whalen

Person

Chelsea, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultraviolet energy curable tape and method of making a semiconducto...
- Patent number 8,163,602
- Issue date Apr 24, 2012
- International Business Machines Corporation
- Timothy C. Krywanczyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultraviolet energy curable tape and method of making a semiconducto...
- Patent number 7,902,682
- Issue date Mar 8, 2011
- International Business Machines Corporation
- Timothy C. Krywanczyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to prevent ECC (edge chipping and cracking) damage during d...
- Patent number 7,771,560
- Issue date Aug 10, 2010
- International Business Machines Corporation
- James R. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of a thermally conductive thin film to a wafer backside...
- Patent number 7,387,911
- Issue date Jun 17, 2008
- International Business Machines Corporation
- David M Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework process for removing residual UV adhesive from C4 wafer surf...
- Patent number 7,348,216
- Issue date Mar 25, 2008
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer front side protection
- Patent number 7,288,465
- Issue date Oct 30, 2007
- International Business Machines Corpoartion
- Allan D. Abrams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer front side protection
- Patent number 7,001,827
- Issue date Feb 21, 2006
- International Business Machines Corporation
- Allan D. Abrams
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRAVIOLET ENERGY CURABLE TAPE AND METHOD OF MAKING A SEMICONDUCTO...
- Publication number 20110115072
- Publication date May 19, 2011
- International Business Machines Corporation
- Timothy C. Krywanczyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO PREVENT ECC (EDGE CHIPPING AND CRACKING) DAMAGE DURING D...
- Publication number 20090084499
- Publication date Apr 2, 2009
- International Business Machines Corporation
- James R. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORK PROCESS FOR REMOVING RESIDUAL UV ADHESIVE FROM C4 WAFER SURF...
- Publication number 20080099149
- Publication date May 1, 2008
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER FRONT SIDE PROTECTION
- Publication number 20080064185
- Publication date Mar 13, 2008
- International Business Machines Corporation
- Allan D. Abrams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rework process for removing residual UV adhesive from C4 wafer surf...
- Publication number 20070077752
- Publication date Apr 5, 2007
- International Business Machines Corporation
- Steven R. Codding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Application of a thermally conductive thin film to a wafer backside...
- Publication number 20060105547
- Publication date May 18, 2006
- International Business Machines Corporation
- David M. Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer front side protection
- Publication number 20050202678
- Publication date Sep 15, 2005
- International Business Machines Corporation
- Allan D. Abrams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultraviolet energy curable tape and method of making a semiconducto...
- Publication number 20050104147
- Publication date May 19, 2005
- International Business Machines Corporation
- Timothy C. Krywanczyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer front side protection
- Publication number 20040209444
- Publication date Oct 21, 2004
- International Business Machines Corporation
- Allan D. Abrams
- H01 - BASIC ELECTRIC ELEMENTS

Matthew R. Whalen

Person

Patents Grantslast 30 patents

Ultraviolet energy curable tape and method of making a semiconducto...

Ultraviolet energy curable tape and method of making a semiconducto...

Methods to prevent ECC (edge chipping and cracking) damage during d...

Application of a thermally conductive thin film to a wafer backside...

Rework process for removing residual UV adhesive from C4 wafer surf...

Semiconductor wafer front side protection

Semiconductor wafer front side protection

Patents Applicationslast 30 patents

ULTRAVIOLET ENERGY CURABLE TAPE AND METHOD OF MAKING A SEMICONDUCTO...

METHODS TO PREVENT ECC (EDGE CHIPPING AND CRACKING) DAMAGE DURING D...

REWORK PROCESS FOR REMOVING RESIDUAL UV ADHESIVE FROM C4 WAFER SURF...

SEMICONDUCTOR WAFER FRONT SIDE PROTECTION

Rework process for removing residual UV adhesive from C4 wafer surf...

Application of a thermally conductive thin film to a wafer backside...

Semiconductor wafer front side protection

Ultraviolet energy curable tape and method of making a semiconducto...

Semiconductor wafer front side protection