Matthew Reynolds

Follow

Person

Sandy, UT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and designs for localized wafer thinning
- Patent number 8,624,393
- Issue date Jan 7, 2014
- Fairchild Semiconductor Corporation
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for dividing a substrate into individual devices
- Patent number 8,343,852
- Issue date Jan 1, 2013
- Fairchild Semiconductor Corporation
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and designs for localized wafer thinning
- Patent number 8,158,506
- Issue date Apr 17, 2012
- Fairchild Semiconductor Corporation
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for dividing a substrate into individual devices
- Patent number 7,951,688
- Issue date May 31, 2011
- Fairchild Semiconductor Corporation
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods and Designs for Localized Wafer Thinning
- Publication number 20120168947
- Publication date Jul 5, 2012
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR DIVIDING A SUBSTRATE INTO INDIVIDUAL DEVICES
- Publication number 20110201179
- Publication date Aug 18, 2011
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DESIGNS FOR LOCALIZED WAFER THINNING
- Publication number 20090273082
- Publication date Nov 5, 2009
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Dividing a Substrate into Individual Devices
- Publication number 20090181520
- Publication date Jul 16, 2009
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS