Matthew S. Kelly

Person

Oakville, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for tin whisker isolation and detection
- Patent number 12,174,241
- Issue date Dec 24, 2024
- International Business Machines Corporation
- Matthew Doyle
- G01 - MEASURING TESTING
Information Patent Grant
Electrical apparatus having tin whisker sensing and prevention
- Patent number 11,619,665
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Jeffrey N. Judd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anti-eavesdrop security device
- Patent number 11,488,571
- Issue date Nov 1, 2022
- International Business Machines Corporation
- Layne A. Berge
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Printed circuit board assembly defect detection
- Patent number 11,423,577
- Issue date Aug 23, 2022
- International Business Machines Corporation
- Matthew S. Kelly
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Advising audit ratings in a multiple-auditor environment
- Patent number 11,403,580
- Issue date Aug 2, 2022
- International Business Machines Corporation
- Paul A. Zulpa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Selective dielectric resin application on circuitized core layers
- Patent number 11,178,757
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-destructive identifying of plating dissolution in soldered, pla...
- Patent number 11,059,120
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Matthew S. Kelly
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass fiber coatings for improved resistance to conductive anodic f...
- Patent number 10,932,363
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Bruce J. Chamberlin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Compliant pin with self sensing deformation
- Patent number 10,768,245
- Issue date Sep 8, 2020
- International Business Machines Corporation
- Matthew S. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruggedized solder mask material
- Patent number 10,739,679
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Matthew Kelly
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making integrated die paddle structures for bottom termin...
- Patent number 10,679,926
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Stephen M. Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruggedized solder mask material
- Patent number 10,670,964
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Matthew Kelly
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via stub elimination by disrupting plating
- Patent number 10,674,613
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via stub elimination by disrupting plating
- Patent number 10,617,014
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid immersion techniques for improved resistance to conductive a...
- Patent number 10,590,037
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Bruce J. Chamberlin
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Integrated die paddle structures for bottom terminated components
- Patent number 10,559,522
- Issue date Feb 11, 2020
- International Business Machines Corporation
- Stephen M. Hugo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass fiber coatings for improved resistance to conductive anodic f...
- Patent number 10,462,900
- Issue date Oct 29, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Selective dielectric resin application on circuitized core layers
- Patent number 10,405,421
- Issue date Sep 3, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via stub elimination by disrupting plating
- Patent number 10,212,828
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Testing printed circuit board assembly
- Patent number 10,168,383
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G01 - MEASURING TESTING
Information Patent Grant
Connector module having insulated metal frame
- Patent number 10,141,703
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Ai K. Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated die paddle structures for bottom terminated components
- Patent number 10,083,894
- Issue date Sep 25, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing printed circuit board assembly
- Patent number 10,048,312
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G01 - MEASURING TESTING
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,986,649
- Issue date May 29, 2018
- International Business Machine Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector module having insulated metal frame
- Patent number 9,972,957
- Issue date May 15, 2018
- International Business Machines Corporation
- Ai K. Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector module having insulated metal frame
- Patent number 9,966,719
- Issue date May 8, 2018
- International Business Machines Corporation
- Ai K. Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder assembly temperature monitoring process
- Patent number 9,733,134
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Stephen Michael Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder assembly temperature monitoring process
- Patent number 9,714,870
- Issue date Jul 25, 2017
- International Business Machines Corporation
- Stephen Michael Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,662,732
- Issue date May 30, 2017
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor-based removal of a soldered device
- Patent number 9,591,795
- Issue date Mar 7, 2017
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Willie Theodore Davis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR TIN WHISKER ISOLATION AND DETECTION
- Publication number 20240219450
- Publication date Jul 4, 2024
- International Business Machines Corporation
- MATTHEW DOYLE
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY DEFECT DETECTION
- Publication number 20220012917
- Publication date Jan 13, 2022
- International Business Machines Corporation
- Matthew S. Kelly
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANTI-EAVESDROP SECURITY DEVICE
- Publication number 20220005449
- Publication date Jan 6, 2022
- International Business Machines Corporation
- Layne A. Berge
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRICAL APPARATUS HAVING TIN WHISKER SENSING AND PREVENTION
- Publication number 20210208190
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Jeffrey N. JUDD
- G01 - MEASURING TESTING
Information Patent Application
NON-DESTRUCTIVE IDENTIFYING OF PLATING DISSOLUTION IN SOLDERED, PLA...
- Publication number 20200139466
- Publication date May 7, 2020
- International Business Machines Corporation
- Matthew S. KELLY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT PIN WITH SELF SENSING DEFORMATION
- Publication number 20200103454
- Publication date Apr 2, 2020
- International Business Machines Corporation
- Matthew S. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVISING AUDIT RATINGS IN A MULTIPLE-AUDITOR ENVIRONMENT
- Publication number 20200012987
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Paul A. Zulpa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GLASS FIBER COATINGS FOR IMPROVED RESISTANCE TO CONDUCTIVE ANODIC F...
- Publication number 20190364659
- Publication date Nov 28, 2019
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS
- Publication number 20190342994
- Publication date Nov 7, 2019
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS
- Publication number 20190342995
- Publication date Nov 7, 2019
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RUGGEDIZED SOLDER MASK MATERIAL
- Publication number 20190324369
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Matthew Kelly
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS
- Publication number 20190191558
- Publication date Jun 20, 2019
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS
- Publication number 20190191559
- Publication date Jun 20, 2019
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA STUB ELIMINATION BY DISRUPTING PLATING
- Publication number 20190182968
- Publication date Jun 13, 2019
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA STUB ELIMINATION BY DISRUPTING PLATING
- Publication number 20190182967
- Publication date Jun 13, 2019
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RUGGEDIZED SOLDER MASK MATERIAL
- Publication number 20190155154
- Publication date May 23, 2019
- International Business Machines Corporation
- Matthew Kelly
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TESTING PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20180328980
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Mark K. Hoffmeyer
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS
- Publication number 20180301399
- Publication date Oct 18, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID IMMERSION TECHNIQUES FOR IMPROVED RESISTANCE TO CONDUCTIVE A...
- Publication number 20180273426
- Publication date Sep 27, 2018
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
GLASS FIBER COATINGS FOR IMPROVED RESISTANCE TO CONDUCTIVE ANODIC F...
- Publication number 20180153042
- Publication date May 31, 2018
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS
- Publication number 20180053711
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Stephen M. Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS
- Publication number 20170179004
- Publication date Jun 22, 2017
- International Business Machines
- Stephen M. Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20170142845
- Publication date May 18, 2017
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20160297022
- Publication date Oct 13, 2016
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNOLOGY FOR TEMPERATURE SENSITIVE COMPONENTS IN THERMAL PROCESSING
- Publication number 20160188786
- Publication date Jun 30, 2016
- International Business Machines Corporation
- Mitchell G. Ferrill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSOR-BASED REMOVAL OF A SOLDERED DEVICE
- Publication number 20160088780
- Publication date Mar 24, 2016
- LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Willie Theodore Davis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20160044791
- Publication date Feb 11, 2016
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS
- Publication number 20160011061
- Publication date Jan 14, 2016
- International Business Machines Corporation
- Stephen Michael Hugo
- G01 - MEASURING TESTING
Information Patent Application
TECHNOLOGY FOR TEMPERATURE SENSITIVE COMPONENTS IN THERMAL PROCESSING
- Publication number 20150342056
- Publication date Nov 26, 2015
- International Business Machines Corporation
- Mitchell G. Ferrill
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS
- Publication number 20140198424
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Stephen Michael Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Matthew S. Kelly

Person

Patents Grantslast 30 patents

Apparatus and method for tin whisker isolation and detection

Electrical apparatus having tin whisker sensing and prevention

Anti-eavesdrop security device

Printed circuit board assembly defect detection

Advising audit ratings in a multiple-auditor environment

Selective dielectric resin application on circuitized core layers

Non-destructive identifying of plating dissolution in soldered, pla...

Glass fiber coatings for improved resistance to conductive anodic f...

Compliant pin with self sensing deformation

Ruggedized solder mask material

Method of making integrated die paddle structures for bottom termin...

Ruggedized solder mask material

Via stub elimination by disrupting plating

Via stub elimination by disrupting plating

Liquid immersion techniques for improved resistance to conductive a...

Integrated die paddle structures for bottom terminated components

Glass fiber coatings for improved resistance to conductive anodic f...

Selective dielectric resin application on circuitized core layers

Via stub elimination by disrupting plating

Testing printed circuit board assembly

Connector module having insulated metal frame

Integrated die paddle structures for bottom terminated components

Testing printed circuit board assembly

Increasing solder hole-fill in a printed circuit board assembly

Connector module having insulated metal frame

Connector module having insulated metal frame

Solder assembly temperature monitoring process

Solder assembly temperature monitoring process

Increasing solder hole-fill in a printed circuit board assembly

Sensor-based removal of a soldered device

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR TIN WHISKER ISOLATION AND DETECTION

PRINTED CIRCUIT BOARD ASSEMBLY DEFECT DETECTION

ANTI-EAVESDROP SECURITY DEVICE

ELECTRICAL APPARATUS HAVING TIN WHISKER SENSING AND PREVENTION

NON-DESTRUCTIVE IDENTIFYING OF PLATING DISSOLUTION IN SOLDERED, PLA...

COMPLIANT PIN WITH SELF SENSING DEFORMATION

ADVISING AUDIT RATINGS IN A MULTIPLE-AUDITOR ENVIRONMENT

GLASS FIBER COATINGS FOR IMPROVED RESISTANCE TO CONDUCTIVE ANODIC F...

SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS

SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS

RUGGEDIZED SOLDER MASK MATERIAL

SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS

SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS

VIA STUB ELIMINATION BY DISRUPTING PLATING

VIA STUB ELIMINATION BY DISRUPTING PLATING

RUGGEDIZED SOLDER MASK MATERIAL

TESTING PRINTED CIRCUIT BOARD ASSEMBLY

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

LIQUID IMMERSION TECHNIQUES FOR IMPROVED RESISTANCE TO CONDUCTIVE A...

GLASS FIBER COATINGS FOR IMPROVED RESISTANCE TO CONDUCTIVE ANODIC F...

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

TECHNOLOGY FOR TEMPERATURE SENSITIVE COMPONENTS IN THERMAL PROCESSING

SENSOR-BASED REMOVAL OF A SOLDERED DEVICE

INCREASING SOLDER HOLE-FILL IN A PRINTED CIRCUIT BOARD ASSEMBLY

SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS

TECHNOLOGY FOR TEMPERATURE SENSITIVE COMPONENTS IN THERMAL PROCESSING

SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS