Matthew Thomas Herrick

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process for depositing a layer of material on a substrate
- Patent number 7,323,094
- Issue date Jan 29, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an opening in a semiconductor device substrate
- Patent number 6,566,264
- Issue date May 20, 2003
- Motorola, Inc.
- Nigel Graeme Cave
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for depositing a layer of material on a substrate
- Patent number 6,500,324
- Issue date Dec 31, 2002
- Motorola, Inc.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 6,372,665
- Issue date Apr 16, 2002
- Motorola Inc.
- Joy Kimi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper layer over a semiconductor wafer
- Patent number 6,297,155
- Issue date Oct 2, 2001
- Motorola Inc.
- Cindy Reidsema Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 6,232,235
- Issue date May 15, 2001
- Motorola, Inc.
- Nigel Graeme Cave
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device
- Patent number 6,218,302
- Issue date Apr 17, 2001
- Motorola Inc.
- Gregor Braeckelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for depositing a layer of material over a substrate
- Patent number 6,174,425
- Issue date Jan 16, 2001
- Motorola, Inc.
- Cindy Reidsema Simpson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming a semiconductor device
- Patent number 6,127,258
- Issue date Oct 3, 2000
- Motorola Inc.
- Joy Kimi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process for depositing a layer of material on a substrate and a pla...
- Publication number 20020195347
- Publication date Dec 26, 2002
- Cindy Reidsema Simpson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Matthew Thomas Herrick

Person

Patents Grantslast 30 patents

Process for depositing a layer of material on a substrate

Method for forming an opening in a semiconductor device substrate

Process for depositing a layer of material on a substrate

Method for forming a semiconductor device

Method for forming a copper layer over a semiconductor wafer

Method of forming a semiconductor device

Method for forming a semiconductor device

Process for depositing a layer of material over a substrate

Method for forming a semiconductor device

Patents Applicationslast 30 patents

Process for depositing a layer of material on a substrate and a pla...