Matthew Whitlock

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Patterned carrier assemblies having an integrated adhesive film
- Patent number 12,154,805
- Issue date Nov 26, 2024
- Daewon Semiconductor Packaging Industrial Company
- Jonathan Kevin Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,764,133
- Issue date Sep 19, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,362,025
- Issue date Jun 14, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separators for handling, transporting, or storing semiconductor wafers
- Patent number 11,257,700
- Issue date Feb 22, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quasi-analog digital pulse-width modulation control
- Patent number 10,826,391
- Issue date Nov 3, 2020
- Licon Technology Corporation
- William Reed
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Quasi-analog digital pulse-width modulation control
- Patent number 10,263,515
- Issue date Apr 16, 2019
- Licon Technology Corporation
- William Reed
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Complementary converter for switch mode power supply
- Patent number 9,699,842
- Issue date Jul 4, 2017
- James A. Allen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
PATTERNED CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20250054791
- Publication date Feb 13, 2025
- Daewon Semiconductor Packaging Industrial Company
- Jonathan Kevin Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID CARRIER ASSEMBLIES WITH TACKY MEDIA MOLDED THEREON
- Publication number 20220384226
- Publication date Dec 1, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20220310494
- Publication date Sep 29, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PATTERNED CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20220013390
- Publication date Jan 13, 2022
- Daewon Semiconductor Packaging Industrial Company
- Jonathan Kevin Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-ANALOG DIGITAL PULSE-WIDTH MODULATION CONTROL
- Publication number 20210175799
- Publication date Jun 10, 2021
- Licon Technology Corporation
- William Reed
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
QUASI-ANALOG DIGITAL PULSE-WIDTH MODULATION CONTROL
- Publication number 20190199208
- Publication date Jun 27, 2019
- Licon Technology Corporation
- William Reed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20190067173
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20190067072
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RIGID CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20190067061
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
- Publication number 20190067064
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
- Publication number 20190067062
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-ANALOG DIGITAL PULSE-WIDTH MODULATION CONTROL
- Publication number 20170302170
- Publication date Oct 19, 2017
- Licon Technology Corporation
- William Reed
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COMPLEMENTARY CONVERTER FOR SWITCH MODE POWER SUPPLY
- Publication number 20170055321
- Publication date Feb 23, 2017
- Licon Technology Corporation
- James A. Allen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Matthew Whitlock

Person

Patents Grantslast 30 patents

Patterned carrier assemblies having an integrated adhesive film

Tape carrier assemblies having an integrated adhesive film

Tape carrier assemblies having an integrated adhesive film

Separators for handling, transporting, or storing semiconductor wafers

Quasi-analog digital pulse-width modulation control

Quasi-analog digital pulse-width modulation control

Complementary converter for switch mode power supply

Patents Applicationslast 30 patents

PATTERNED CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

RIGID CARRIER ASSEMBLIES WITH TACKY MEDIA MOLDED THEREON

TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

PATTERNED CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

QUASI-ANALOG DIGITAL PULSE-WIDTH MODULATION CONTROL

QUASI-ANALOG DIGITAL PULSE-WIDTH MODULATION CONTROL

TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

RIGID CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM

SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS

SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS

QUASI-ANALOG DIGITAL PULSE-WIDTH MODULATION CONTROL

COMPLEMENTARY CONVERTER FOR SWITCH MODE POWER SUPPLY