Matthias Bonkass

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Technique for metal deposition by electroless plating using an acti...
- Patent number 7,560,381
- Issue date Jul 14, 2009
- Advanced Micro Devices, Inc.
- Markus Nopper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for controlling ion distribution during plating o...
- Patent number 6,974,530
- Issue date Dec 13, 2005
- Advanced Micro Devices, Inc.
- Matthias Bonkass
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Technique for metal deposition by electroless plating using an acti...
- Publication number 20060194431
- Publication date Aug 31, 2006
- Markus Nopper
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and system for controlling a substrate position in an electr...
- Publication number 20060193992
- Publication date Aug 31, 2006
- Matthias Bonkass
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System and method for an increased bath lifetime in a single-use pl...
- Publication number 20050241947
- Publication date Nov 3, 2005
- Markus Nopper
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and system for automatically controlling a current distribut...
- Publication number 20050067290
- Publication date Mar 31, 2005
- Matthias Bonkass
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and system for controlling ion distribution during plating o...
- Publication number 20040000487
- Publication date Jan 1, 2004
- Matthias Bonkass
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of electroplating copper over a patterned dielectric layer
- Publication number 20030221966
- Publication date Dec 4, 2003
- Matthias Bonkass
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Matthias Bonkass

Person

Patents Grantslast 30 patents

Technique for metal deposition by electroless plating using an acti...

Method and system for controlling ion distribution during plating o...

Patents Applicationslast 30 patents

Technique for metal deposition by electroless plating using an acti...

Method and system for controlling a substrate position in an electr...

System and method for an increased bath lifetime in a single-use pl...

Method and system for automatically controlling a current distribut...

Method and system for controlling ion distribution during plating o...

Method of electroplating copper over a patterned dielectric layer