Matthias Klein

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Berlin, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming packaged semiconductor die with micro-cavity
- Patent number 11,538,726
- Issue date Dec 27, 2022
- Microchip Technology Inc.
- Matthias Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor die with micro-cavity
- Patent number 11,244,876
- Issue date Feb 8, 2022
- Microchip Technology Inc.
- Matthias Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component arrangement and method for production thereof
- Patent number 8,564,969
- Issue date Oct 22, 2013
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Hans-Hermann Oppermann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
In vivo implantable coil assembly
- Patent number 8,521,303
- Issue date Aug 27, 2013
- University of Utah Reasearch Foundation
- Florian Solzbacher
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Flip chip metallization method and devices
- Patent number 7,388,288
- Issue date Jun 17, 2008
- University of Utah Research Foundation
- Florian Solzbacher
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Forming Packaged Semiconductor Die with Micro-Cavity
- Publication number 20220115282
- Publication date Apr 14, 2022
- Microchip Technology Inc.
- Matthias Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Die with Micro-Cavity and Method for Forming...
- Publication number 20210111082
- Publication date Apr 15, 2021
- Microchip Technology Inc.
- Matthias Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR JOINING A FIRST ELECTRONIC COMPONENT AND A SECOND COMPONENT
- Publication number 20130214033
- Publication date Aug 22, 2013
- Vectron International GmbH
- Matthias KLEIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR