Matthias SCHMIDT

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor device and electronic assembly
- Patent number 12,085,526
- Issue date Sep 10, 2024
- TDK Corporation
- Matthias König
- G01 - MEASURING TESTING
Information Patent Grant
Packaged die and assembling method
- Patent number 11,597,647
- Issue date Mar 7, 2023
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages and methods of formation thereof
- Patent number 8,866,274
- Issue date Oct 21, 2014
- Infineon Technologies AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit for impedance matching
- Patent number 8,400,233
- Issue date Mar 19, 2013
- EPCOS AG
- Patrick Scheele
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...
- Publication number 20240112956
- Publication date Apr 4, 2024
- INFINEON TECHNOLOGIES AUSTRIA AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Die and Assembling Method
- Publication number 20210238028
- Publication date Aug 5, 2021
- TDK Corporation
- Andreas Barbul
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Device and Electronic Assembly
- Publication number 20200049647
- Publication date Feb 13, 2020
- TDK Electronics AG
- Matthias König
- G01 - MEASURING TESTING
Information Patent Application
LIQUID PROOF PRESSURE SENSOR
- Publication number 20200031661
- Publication date Jan 30, 2020
- InvenSense, Inc.
- Calin MICLAUS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Packages and Methods of Formation Thereof
- Publication number 20130256857
- Publication date Oct 3, 2013
- INFINEON TECHNOLOGIES AG
- Hermann Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit for Impedance Matching
- Publication number 20130005288
- Publication date Jan 3, 2013
- EPCOS AG
- Patrick Scheele
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Circuit for Impedance Matching
- Publication number 20110090021
- Publication date Apr 21, 2011
- Patrick Scheele
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Matthias SCHMIDT

Person

Patents Grantslast 30 patents

Sensor device and electronic assembly

Packaged die and assembling method

Semiconductor packages and methods of formation thereof

Circuit for impedance matching

Patents Applicationslast 30 patents

WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING...

Packaged Die and Assembling Method

Sensor Device and Electronic Assembly

LIQUID PROOF PRESSURE SENSOR

Semiconductor Packages and Methods of Formation Thereof

Circuit for Impedance Matching

Circuit for Impedance Matching