Matthias Steiert

Person

Ehrenkirchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level method for manufacturing integrated infrared (IR) emitt...
- Patent number 11,402,556
- Issue date Aug 2, 2022
- Infineon Technologies AG
- Stephan Pindl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die stack arrangement comprising a die-attach-film tape and method...
- Patent number 11,342,298
- Issue date May 24, 2022
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die stack arrangement comprising a die-attach-film tape and method...
- Patent number 10,861,818
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing packaged MEMS assemblies at the wafer level, a...
- Patent number 10,793,429
- Issue date Oct 6, 2020
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sound transducer element and method for producing a MEMS sound...
- Patent number 10,616,703
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing packaged MEMS assemblies at the wafer level, a...
- Patent number 10,584,028
- Issue date Mar 10, 2020
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with a through port for sensor applications
- Patent number 10,549,985
- Issue date Feb 4, 2020
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a MEMS sensor, and MEMS sensor
- Patent number 10,486,961
- Issue date Nov 26, 2019
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus with a high heat capacity and method for producing the same
- Patent number 10,377,626
- Issue date Aug 13, 2019
- Infineon Technologies AG
- Bernd Goller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic sensor device including a flip-chip mounted semiconducto...
- Patent number 10,155,657
- Issue date Dec 18, 2018
- Infineon Technologies AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded package structure with glue bleed stopper for sealing a MEMs...
- Patent number 9,475,691
- Issue date Oct 25, 2016
- Infineon Technologies AG
- Kok Yau Chua
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Die Stack Arrangement Comprising a Die-Attach-Film Tape and Method...
- Publication number 20210005568
- Publication date Jan 7, 2021
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Manufacturing Integrated Emitter Elements Having an Opti...
- Publication number 20200249380
- Publication date Aug 6, 2020
- INFINEON TECHNOLOGIES AG
- Stephan Pindl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING PACKAGED MEMS ASSEMBLIES AT THE WAFER LEVEL, A...
- Publication number 20200156933
- Publication date May 21, 2020
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACK ARRANGEMENT AND METHOD FOR PRODUCING SAME
- Publication number 20190304945
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MEMS SENSOR, AND MEMS SENSOR
- Publication number 20190055117
- Publication date Feb 21, 2019
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING PACKAGED MEMS ASSEMBLIES AT THE WAFER LEVEL, A...
- Publication number 20180327258
- Publication date Nov 15, 2018
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS WITH A HIGH HEAT CAPACITY AND METHOD FOR PRODUCING THE SAME
- Publication number 20180305200
- Publication date Oct 25, 2018
- INFINEON TECHNOLOGIES AG
- Bernd Goller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SOUND TRANSDUCER ELEMENT AND METHOD FOR PRODUCING A MEMS SOUND...
- Publication number 20180295458
- Publication date Oct 11, 2018
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Package with a Through Port for Sensor Applications a...
- Publication number 20180148322
- Publication date May 31, 2018
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC SENSOR DEVICE INCLUDING A FLIP-CHIP MOUNTED SEMICONDUCTO...
- Publication number 20170081175
- Publication date Mar 23, 2017
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Matthias Steiert

Person

Patents Grantslast 30 patents

Wafer level method for manufacturing integrated infrared (IR) emitt...

Die stack arrangement comprising a die-attach-film tape and method...

Die stack arrangement comprising a die-attach-film tape and method...

Method for producing packaged MEMS assemblies at the wafer level, a...

MEMS sound transducer element and method for producing a MEMS sound...

Method for producing packaged MEMS assemblies at the wafer level, a...

Semiconductor package with a through port for sensor applications

Method for producing a MEMS sensor, and MEMS sensor

Apparatus with a high heat capacity and method for producing the same

Electronic sensor device including a flip-chip mounted semiconducto...

Molded package structure with glue bleed stopper for sealing a MEMs...

Patents Applicationslast 30 patents

Die Stack Arrangement Comprising a Die-Attach-Film Tape and Method...

Method for Manufacturing Integrated Emitter Elements Having an Opti...

METHOD FOR PRODUCING PACKAGED MEMS ASSEMBLIES AT THE WAFER LEVEL, A...

DIE STACK ARRANGEMENT AND METHOD FOR PRODUCING SAME

METHOD FOR PRODUCING A MEMS SENSOR, AND MEMS SENSOR

METHOD FOR PRODUCING PACKAGED MEMS ASSEMBLIES AT THE WAFER LEVEL, A...

APPARATUS WITH A HIGH HEAT CAPACITY AND METHOD FOR PRODUCING THE SAME

MEMS SOUND TRANSDUCER ELEMENT AND METHOD FOR PRODUCING A MEMS SOUND...

Semiconductor Package with a Through Port for Sensor Applications a...

ELECTRONIC SENSOR DEVICE INCLUDING A FLIP-CHIP MOUNTED SEMICONDUCTO...