Maurice O. Othieno

Person

Alameda, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhanced pad design for solder attach devices
- Patent number 8,163,643
- Issue date Apr 24, 2012
- Linear Technology Corporation
- Maurice O. Othieno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method using isolated VSS plane to accomm...
- Patent number 8,129,759
- Issue date Mar 6, 2012
- LSI Logic Corporation
- Maurice O. Othieno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond integrated circuit package for high speed I/O
- Patent number 7,804,167
- Issue date Sep 28, 2010
- LSI Logic Corporation
- Clifford Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method using isolated Vss plane to accomm...
- Patent number 7,646,091
- Issue date Jan 12, 2010
- LSI Corporation
- Maurice O. Othieno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and process utilizing pre-formed mold cap and...
- Patent number 7,436,060
- Issue date Oct 14, 2008
- LSI Corporation
- Pradip Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader in integrated circuit package
- Patent number 7,420,809
- Issue date Sep 2, 2008
- LSI Corporation
- Hong T. Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two layer substrate ball grid array design
- Patent number 7,327,043
- Issue date Feb 5, 2008
- LSI Logic Corporation
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heatspreader for use in wire bonded ball grid array semi...
- Patent number 7,235,889
- Issue date Jun 26, 2007
- LSI Corporation
- Maurice O. Othieno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a thermally and electrically connected...
- Patent number 6,933,602
- Issue date Aug 23, 2005
- LSI Logic Corporation
- Pradip Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference package protection
- Patent number 6,867,480
- Issue date Mar 15, 2005
- LSI Logic Corporation
- Severino A. Legaspi, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slotted bonding pad
- Patent number 6,825,563
- Issue date Nov 30, 2004
- LSI Logic Corporation
- Ramaswamy Ranganathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic organic substrate
- Patent number 6,801,437
- Issue date Oct 5, 2004
- LSI Logic Corporation
- Maurice O. Othieno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mask on bonding ring
- Patent number 6,777,803
- Issue date Aug 17, 2004
- LSI Logic Corporation
- Maurice Othieno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top gated heat dissipation
- Patent number 6,654,248
- Issue date Nov 25, 2003
- LSI Logic Corporation
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate
- Patent number 6,603,201
- Issue date Aug 5, 2003
- LSI Logic Corporation
- Manickam Thavarajah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD USING ISOLATED VSS PLANE TO ACCOMM...
- Publication number 20100067207
- Publication date Mar 18, 2010
- LSI Corporation
- Maurice O. Othieno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND INTEGRATED CIRCUIT PACKAGE FOR HIGH SPEED I/O
- Publication number 20080128919
- Publication date Jun 5, 2008
- Clifford Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method using isolated Vss plane to accomm...
- Publication number 20070235849
- Publication date Oct 11, 2007
- LSI Logic Corporation
- Maurice O. Othieno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two layer substrate ball grid array design
- Publication number 20070040284
- Publication date Feb 22, 2007
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated heatspreader for use in wire bonded ball grid array semi...
- Publication number 20060055029
- Publication date Mar 16, 2006
- LSI Logic Corporation
- Maurice O. Othieno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader in integrated circuit package
- Publication number 20050281011
- Publication date Dec 22, 2005
- Hong T. Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and process utilizing pre-formed mold cap and...
- Publication number 20050275086
- Publication date Dec 15, 2005
- LSI Logic Corporation
- Pradip Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic interference package protection
- Publication number 20040251522
- Publication date Dec 16, 2004
- Severino A. Legaspi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic organic substrate
- Publication number 20040142556
- Publication date Jul 22, 2004
- Maurice O. Othieno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder mask on bonding ring
- Publication number 20040041252
- Publication date Mar 4, 2004
- Maurice Othieno
- H01 - BASIC ELECTRIC ELEMENTS

Maurice O. Othieno

Person

Patents Grantslast 30 patents

Enhanced pad design for solder attach devices

Semiconductor package and method using isolated VSS plane to accomm...

Wire bond integrated circuit package for high speed I/O

Semiconductor package and method using isolated Vss plane to accomm...

Semiconductor package and process utilizing pre-formed mold cap and...

Heat spreader in integrated circuit package

Two layer substrate ball grid array design

Integrated heatspreader for use in wire bonded ball grid array semi...

Semiconductor package having a thermally and electrically connected...

Electromagnetic interference package protection

Slotted bonding pad

Electronic organic substrate

Solder mask on bonding ring

Top gated heat dissipation

Electronic substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD USING ISOLATED VSS PLANE TO ACCOMM...

WIRE BOND INTEGRATED CIRCUIT PACKAGE FOR HIGH SPEED I/O

Semiconductor package and method using isolated Vss plane to accomm...

Two layer substrate ball grid array design

Integrated heatspreader for use in wire bonded ball grid array semi...

Heat spreader in integrated circuit package

Semiconductor package and process utilizing pre-formed mold cap and...

Electromagnetic interference package protection

Electronic organic substrate

Solder mask on bonding ring