Maurice Rivoire

Person

Meylan, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Plurality of substrates bonded by direct bonding of copper recesses
- Patent number 9,865,545
- Issue date Jan 9, 2018
- STMicroelectronics (Crolles 2) SAS
- Maurice Rivoire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for modifying the crystalline structure of a copper element
- Patent number 9,620,412
- Issue date Apr 11, 2017
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing recesses filled with copper
- Patent number 9,620,385
- Issue date Apr 11, 2017
- STMicroelectronics (Crolles 2) SAS
- Maurice Rivoire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified copper-copper bonding
- Patent number 8,647,983
- Issue date Feb 11, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming porous material in microcavity or micropassage b...
- Patent number 8,562,934
- Issue date Oct 22, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Christophe Coiffic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a membrane comprising micropassages made from...
- Patent number 8,323,733
- Issue date Dec 4, 2012
- Commisariat a l'Energie Atomique
- Jean-Christophe Coiffic
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Light sensor located above an integrated circuit
- Patent number 7,713,766
- Issue date May 11, 2010
- STMicroelectronics S.A.
- Danielle Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light sensor located above an integrated circuit
- Patent number 7,492,026
- Issue date Feb 17, 2009
- STMicroelectronics S.A.
- Danielle Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abrasive composition for the integrated circuit electronics industry
- Patent number 7,252,695
- Issue date Aug 7, 2007
- AZ Electronic Materials USA Corp.
- Eric Jacquinot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a variable capacitor component
- Patent number 7,200,908
- Issue date Apr 10, 2007
- STMicroelectronics S.A.
- Fabrice Cassett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abrasive composition for the integrated circuits electronics industry
- Patent number 7,144,814
- Issue date Dec 5, 2006
- AZ Electronic Materials USA Corp.
- Eric Jacquinot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component comprising a variable capacitor
- Patent number 7,082,024
- Issue date Jul 25, 2006
- STMicroelectronics S.A.
- Fabrice Casset
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for obtaining a layer of single-crystal germanium or silico...
- Patent number 6,429,098
- Issue date Aug 6, 2002
- France Telecom
- Daniel Bensahel
- C30 - CRYSTAL GROWTH
Information Patent Grant
Process for fabricating a planar heterostructure
- Patent number 6,399,502
- Issue date Jun 4, 2002
- France Telecom
- Caroline Hernandez
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Process for mechanical chemical polishing of layer of aluminium or...
- Patent number 6,386,950
- Issue date May 14, 2002
- Clariant (France) S.A.
- Eric Jacquinot
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composition for mechanical chemical polishing of layers in an insul...
- Patent number 6,362,108
- Issue date Mar 26, 2002
- Clariant (France) S.A.
- Eric Jacquinot
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for mechanical chemical polishing of a layer in a copper-ba...
- Patent number 6,302,765
- Issue date Oct 16, 2001
- Clariant France S.A.
- Eric Jacquinot
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing process for layers of semiconductor o...
- Patent number 6,126,518
- Issue date Oct 3, 2000
- Clariant (France) S. A.
- Eric Jacquinot
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Process for obtaining a layer of single-crystal germanium or silico...
- Patent number 6,117,750
- Issue date Sep 12, 2000
- France Telecom
- Daniel Bensahel
- C30 - CRYSTAL GROWTH
Information Patent Grant
Chemical mechanical polishing process for layers of isolating mater...
- Patent number 6,043,159
- Issue date Mar 28, 2000
- Clariant Chimie S.A.
- Eric Jacquinot
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of pretreating the deposition chamber and/or the substrate f...
- Patent number 5,431,964
- Issue date Jul 11, 1995
- France Telecom (Etablissement Public National)
- Maurice Rivoire
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF PLANARIZING RECESSES FILLED WITH COPPER
- Publication number 20170179035
- Publication date Jun 22, 2017
- STMicroelectronics (Crolles 2) SAS
- Maurice Rivoire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PLANARIZING RECESSES FILLED WITH COPPER
- Publication number 20150340269
- Publication date Nov 26, 2015
- STMicroelectronics (Crolles 2) SAS
- Maurice Rivoire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MODIFYING THE CRYSTALLINE STRUCTURE OF A COPPER ELEMENT
- Publication number 20120097296
- Publication date Apr 26, 2012
- Commisariat A L'Energie Atomique ET Aux Ene Alt
- Lea Di Cioccio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMPLIFIED COPPER-COPPER BONDING
- Publication number 20120100657
- Publication date Apr 26, 2012
- STMicroelectronics (Crolles 2) SAS
- Lea Di Cioccio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING POROUS MATERIAL IN MICROCAVITY OR MICROPASSAGE B...
- Publication number 20110034329
- Publication date Feb 10, 2011
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean-Christophe Coiffic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a membrane comprising micropassages made from...
- Publication number 20090252871
- Publication date Oct 8, 2009
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Jean-Christophe Coiffic
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
LIGHT SENSOR LOCATED ABOVE AN INTEGRATED CIRCUIT
- Publication number 20090075410
- Publication date Mar 19, 2009
- STMicroelectronics S.A.
- Danielle Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
New abrasive composition for the integrated circuit electronics ind...
- Publication number 20070051918
- Publication date Mar 8, 2007
- AZ Electronic Materials USA Corp.
- Eric Jacquinot
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Component comprising a variable capacitor
- Publication number 20060213044
- Publication date Sep 28, 2006
- STMicroelectronics S.A.
- Fabrice Casset
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light sensor located above an integrated circuit
- Publication number 20060145282
- Publication date Jul 6, 2006
- STMicroelectronics S.A.
- Danielle Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT COMPRISING A VARIABLE CAPACITOR
- Publication number 20060114638
- Publication date Jun 1, 2006
- Fabrice Casset
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for planarizing organosilicate layers
- Publication number 20020160692
- Publication date Oct 31, 2002
- APPLIED MATERIALS, INC.
- Maurice Rivoire
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ABRASIVE COMPOSITION FOR THE INTEGRATED CIRCUITS ELECTRONICS INDUSTRY
- Publication number 20020142600
- Publication date Oct 3, 2002
- ERIC JACQUINOT
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Maurice Rivoire

Person

Patents Grantslast 30 patents

Plurality of substrates bonded by direct bonding of copper recesses

Method for modifying the crystalline structure of a copper element

Method of planarizing recesses filled with copper

Simplified copper-copper bonding

Method for forming porous material in microcavity or micropassage b...

Method for producing a membrane comprising micropassages made from...

Light sensor located above an integrated circuit

Light sensor located above an integrated circuit

Abrasive composition for the integrated circuit electronics industry

Method of making a variable capacitor component

Abrasive composition for the integrated circuits electronics industry

Component comprising a variable capacitor

Process for obtaining a layer of single-crystal germanium or silico...

Process for fabricating a planar heterostructure

Process for mechanical chemical polishing of layer of aluminium or...

Composition for mechanical chemical polishing of layers in an insul...

Process for mechanical chemical polishing of a layer in a copper-ba...

Chemical mechanical polishing process for layers of semiconductor o...

Process for obtaining a layer of single-crystal germanium or silico...

Chemical mechanical polishing process for layers of isolating mater...

Method of pretreating the deposition chamber and/or the substrate f...

Patents Applicationslast 30 patents

METHOD OF PLANARIZING RECESSES FILLED WITH COPPER

METHOD OF PLANARIZING RECESSES FILLED WITH COPPER

METHOD FOR MODIFYING THE CRYSTALLINE STRUCTURE OF A COPPER ELEMENT

SIMPLIFIED COPPER-COPPER BONDING

METHOD FOR FORMING POROUS MATERIAL IN MICROCAVITY OR MICROPASSAGE B...

Method for producing a membrane comprising micropassages made from...

LIGHT SENSOR LOCATED ABOVE AN INTEGRATED CIRCUIT

New abrasive composition for the integrated circuit electronics ind...

Component comprising a variable capacitor

Light sensor located above an integrated circuit

COMPONENT COMPRISING A VARIABLE CAPACITOR

Method for planarizing organosilicate layers

ABRASIVE COMPOSITION FOR THE INTEGRATED CIRCUITS ELECTRONICS INDUSTRY