Mauro Mazzola

Person

Calvenzano (Bergamo), IT

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor products, corresponding subst...
- Patent number 11,967,544
- Issue date Apr 23, 2024
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for semiconductor devices, corresponding semiconductor pr...
- Patent number 11,557,547
- Issue date Jan 17, 2023
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a flip chip semiconductor package and a c...
- Patent number 10,872,845
- Issue date Dec 22, 2020
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosonically bonded connection for flip chip packages
- Patent number 10,741,415
- Issue date Aug 11, 2020
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosonically bonded connection for flip chip packages
- Patent number 10,141,197
- Issue date Nov 27, 2018
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device packages
- Patent number 7,084,003
- Issue date Aug 1, 2006
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset edges mold for plastic packaging of integrated semiconductor...
- Patent number 6,592,352
- Issue date Jul 15, 2003
- STMicroelectronics S.r.l.
- Renato Poinelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic body surface-mounting semiconductor power device having dim...
- Patent number 5,852,324
- Issue date Dec 22, 1998
- SGS Thomson Microelectronics S.r.l.
- Renato Poinelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for supporting integrated semiconductor devices
- Patent number 5,617,295
- Issue date Apr 1, 1997
- SGS-Thomson Microelectronics, S.R.L.
- Renato Poinelli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...
- Publication number 20250079386
- Publication date Mar 6, 2025
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING PRE-MO...
- Publication number 20250014982
- Publication date Jan 9, 2025
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20240355714
- Publication date Oct 24, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, CORRESPONDING SUBST...
- Publication number 20240266259
- Publication date Aug 8, 2024
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON...
- Publication number 20240250058
- Publication date Jul 25, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20240194570
- Publication date Jun 13, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...
- Publication number 20240178105
- Publication date May 30, 2024
- STMicroelectronics S.r.l.
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20240178179
- Publication date May 30, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...
- Publication number 20240145355
- Publication date May 2, 2024
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240145351
- Publication date May 2, 2024
- STMicroelectronics S.r.l
- Matteo DE SANTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230245955
- Publication date Aug 3, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230245994
- Publication date Aug 3, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20230114535
- Publication date Apr 13, 2023
- STMicroelectronics S.r.l
- Matteo DE SANTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20230049088
- Publication date Feb 16, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...
- Publication number 20230031682
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPON...
- Publication number 20230031356
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...
- Publication number 20230031422
- Publication date Feb 2, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...
- Publication number 20230005824
- Publication date Jan 5, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...
- Publication number 20230005825
- Publication date Jan 5, 2023
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, COMPONENT FOR USE TH...
- Publication number 20220199500
- Publication date Jun 23, 2022
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, CORRESPONDING SUBST...
- Publication number 20210375726
- Publication date Dec 2, 2021
- STMicroelectronics S.r.l
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME FOR SEMICONDUCTOR DEVICES, CORRESPONDING SEMICONDUCTOR PR...
- Publication number 20210193591
- Publication date Jun 24, 2021
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSONICALLY BONDED CONNECTION FOR FLIP CHIP PACKAGES
- Publication number 20190088503
- Publication date Mar 21, 2019
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MANUFACTURING A FLIP CHIP SEMICONDUCTOR PACKAGE AND A C...
- Publication number 20180374780
- Publication date Dec 27, 2018
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSONICALLY BONDED CONNECTION FOR FLIP CHIP PACKAGES
- Publication number 20170287730
- Publication date Oct 5, 2017
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device packages
- Publication number 20030134452
- Publication date Jul 17, 2003
- STMicroelectronics S.r.l.
- Mauro Mazzola
- H01 - BASIC ELECTRIC ELEMENTS

Mauro Mazzola

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor products, corresponding subst...

Leadframe for semiconductor devices, corresponding semiconductor pr...

Process for manufacturing a flip chip semiconductor package and a c...

Thermosonically bonded connection for flip chip packages

Thermosonically bonded connection for flip chip packages

Method for manufacturing semiconductor device packages

Offset edges mold for plastic packaging of integrated semiconductor...

Plastic body surface-mounting semiconductor power device having dim...

Leadframe for supporting integrated semiconductor devices

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING PRE-MO...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, CORRESPONDING SUBST...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...

METHOD OF PRODUCING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRESPON...

METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...

METHOD OF MANUFACTURING SUBSTRATES FOR SEMICONDUCTOR DEVICES, CORRE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SUBSTR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, COMPONENT FOR USE TH...

METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, CORRESPONDING SUBST...

LEADFRAME FOR SEMICONDUCTOR DEVICES, CORRESPONDING SEMICONDUCTOR PR...

THERMOSONICALLY BONDED CONNECTION FOR FLIP CHIP PACKAGES

PROCESS FOR MANUFACTURING A FLIP CHIP SEMICONDUCTOR PACKAGE AND A C...

THERMOSONICALLY BONDED CONNECTION FOR FLIP CHIP PACKAGES

Method for manufacturing semiconductor device packages