Max Chen

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Taipie Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for assembling a semiconductor chip utilizing conducting bar...
- Patent number 6,927,094
- Issue date Aug 9, 2005
- General Semiconductor of Taiwan, Ltd.
- Max Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging assembly
- Patent number 6,576,985
- Issue date Jun 10, 2003
- General Semiconductor Taiwan, Ltd.
- Max Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device packaging assembly and method for manufacturin...
- Publication number 20030205792
- Publication date Nov 6, 2003
- Max Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device packaging assembly and method for manufacturin...
- Publication number 20020000647
- Publication date Jan 3, 2002
- Max Chen
- H01 - BASIC ELECTRIC ELEMENTS