Max L. Lifson

Person

S. Burlington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 11,152,495
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 11,081,572
- Issue date Aug 3, 2021
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 10,629,710
- Issue date Apr 21, 2020
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 10,600,893
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 10,109,553
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 10,068,827
- Issue date Sep 4, 2018
- International Business Machines Corporation
- Alan B. Botula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 9,704,978
- Issue date Jul 11, 2017
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Apparatus and method for centering substrates on a chuck
- Patent number 9,685,362
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Shawn A. Adderly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 9,666,701
- Issue date May 30, 2017
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Tsv wafer with improved fracture strength
- Patent number 9,607,929
- Issue date Mar 28, 2017
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 9,601,606
- Issue date Mar 21, 2017
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method and apparatus for detecting foreign material on a chuck
- Patent number 9,508,578
- Issue date Nov 29, 2016
- GLOBALFOUNDRIES Inc.
- Shawn A. Adderly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit heat dissipation using nanostructures
- Patent number 9,324,628
- Issue date Apr 26, 2016
- International Business Machines Corporation
- Alan B. Botula
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods of forming a TSV wafer with improved fracture strength
- Patent number 9,312,205
- Issue date Apr 12, 2016
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform roughness on backside of a wafer
- Patent number 9,275,868
- Issue date Mar 1, 2016
- GLOBALFOUNDRIES Inc.
- Shawn A. Adderly
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20200027973
- Publication date Jan 23, 2020
- International Business Machines Corporation
- Alan B. BOTULA
- B82 - NANO-TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20190363182
- Publication date Nov 28, 2019
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20180331207
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Alan B. BOTULA
- B82 - NANO-TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20180294346
- Publication date Oct 11, 2018
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20170200665
- Publication date Jul 13, 2017
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20170117206
- Publication date Apr 27, 2017
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20160204048
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20160204233
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20160126158
- Publication date May 5, 2016
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV WAFER WITH IMPROVED FRACTURE STRENGTH
- Publication number 20150348876
- Publication date Dec 3, 2015
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV WAFER FRACTURE STRENGTH
- Publication number 20150255404
- Publication date Sep 10, 2015
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES
- Publication number 20150243578
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Alan B. BOTULA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Centering Substrates on a Chuck
- Publication number 20150235881
- Publication date Aug 20, 2015
- International Business Machines Corporation
- Shawn A. Adderly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DETECTING FOREIGN MATERIAL ON A CHUCK
- Publication number 20150219479
- Publication date Aug 6, 2015
- International Business Machines Corporation
- Shawn A. Adderly
- G01 - MEASURING TESTING
Information Patent Application
UNIFORM ROUGHNESS ON BACKSIDE OF A WAFER
- Publication number 20150021743
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Shawn A. ADDERLY
- H01 - BASIC ELECTRIC ELEMENTS

Max L. Lifson

Person

Patents Grantslast 30 patents

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Integrated circuit heat dissipation using nanostructures

Apparatus and method for centering substrates on a chuck

Integrated circuit heat dissipation using nanostructures

Tsv wafer with improved fracture strength

Integrated circuit heat dissipation using nanostructures

Method and apparatus for detecting foreign material on a chuck

Integrated circuit heat dissipation using nanostructures

Methods of forming a TSV wafer with improved fracture strength

Uniform roughness on backside of a wafer

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

TSV WAFER WITH IMPROVED FRACTURE STRENGTH

TSV WAFER FRACTURE STRENGTH

INTEGRATED CIRCUIT HEAT DISSIPATION USING NANOSTRUCTURES

Apparatus and Method for Centering Substrates on a Chuck

METHOD AND APPARATUS FOR DETECTING FOREIGN MATERIAL ON A CHUCK

UNIFORM ROUGHNESS ON BACKSIDE OF A WAFER