Max Liu

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Jhubei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Barrier structures and methods for through substrate vias
- Patent number 8,704,375
- Issue date Apr 22, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Max Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Barrier Structures and Methods for Through Substrate Vias
- Publication number 20100193954
- Publication date Aug 5, 2010
- Max Liu
- H01 - BASIC ELECTRIC ELEMENTS