Max Mah Boon Hooi

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Perai, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method of post-mold grinding a semiconductor package
- Patent number 8,124,471
- Issue date Feb 28, 2012
- Intel Corporation
- James-Yii Lee Kiong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE
- Publication number 20120175786
- Publication date Jul 12, 2012
- James Yii Lee Kiong
- H01 - BASIC ELECTRIC ELEMENTS