Maxat Touzelbaev

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Performance state boost for multi-core integrated circuit
- Patent number 9,483,092
- Issue date Nov 1, 2016
- Advanced Micro Devices, Inc.
- Samuel Naffziger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked semiconductor chips with thermal management
- Patent number 9,385,055
- Issue date Jul 5, 2016
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Valley-fill power factor correction circuit with active conduction...
- Patent number 9,263,944
- Issue date Feb 16, 2016
- Maxat Touzelbaev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material with support structure
- Patent number 9,263,364
- Issue date Feb 16, 2016
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computing center power and cooling control apparatus and method
- Patent number 8,868,944
- Issue date Oct 21, 2014
- ATI Technologies ULC
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lid attach process
- Patent number 8,865,527
- Issue date Oct 21, 2014
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient thermal modeling of multisource power devices
- Patent number 8,635,044
- Issue date Jan 21, 2014
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- G01 - MEASURING TESTING
Information Patent Grant
Lid attach process
- Patent number 8,497,162
- Issue date Jul 30, 2013
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip thermal interface structures
- Patent number 8,304,291
- Issue date Nov 6, 2012
- Advanced Micro Devices, Inc.
- Maxat N. Touzelbaev
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material with support structure
- Patent number 8,034,662
- Issue date Oct 11, 2011
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void reduction in indium thermal interface material
- Patent number 7,999,394
- Issue date Aug 16, 2011
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink for a circuit device
- Patent number 7,911,791
- Issue date Mar 22, 2011
- ATI Technologies ULC
- Gamal Refai-Ahmed
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method for decreasing surface delamination of gel-type thermal inte...
- Patent number 7,833,839
- Issue date Nov 16, 2010
- GLOBALFOUNDRIES Inc.
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with gel-type thermal interface material
- Patent number 7,678,615
- Issue date Mar 16, 2010
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Void reduction in indium thermal interface material
- Patent number 7,651,938
- Issue date Jan 26, 2010
- Advanced Micro Devices, Inc.
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer measurement of an integrated circuit
- Patent number 6,984,064
- Issue date Jan 10, 2006
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- G01 - MEASURING TESTING
Information Patent Grant
Feedforward temperature control of device under test
- Patent number 6,794,620
- Issue date Sep 21, 2004
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- G01 - MEASURING TESTING
Information Patent Grant
Voltage programmable power dissipater
- Patent number 6,448,992
- Issue date Sep 10, 2002
- Advanced Micro Devices, Inc.
- Maxat Touzelbaev
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
Valley-Fill Power Factor Correction Circuit with Active Conduction...
- Publication number 20150194883
- Publication date Jul 9, 2015
- Maxat Touzelbaev
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PERFORMANCE STATE BOOST FOR MULTI-CORE INTEGRATED CIRCUIT
- Publication number 20150106642
- Publication date Apr 16, 2015
- Advanced Micro Devices, Inc.
- Samuel Naffziger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LID ATTACH PROCESS
- Publication number 20130309814
- Publication date Nov 21, 2013
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transient Thermal Modeling of Multisource Power Devices
- Publication number 20120278029
- Publication date Nov 1, 2012
- ATI Technologies ULC
- Maxat Touzelbaev
- G01 - MEASURING TESTING
Information Patent Application
STACKED SEMICONDUCTOR CHIPS WITH THERMAL MANAGEMENT
- Publication number 20120043668
- Publication date Feb 23, 2012
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL WITH SUPPORT STRUCTURE
- Publication number 20110304051
- Publication date Dec 15, 2011
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTING CENTER POWER AND COOLING CONTROL APPARATUS AND METHOD
- Publication number 20110245981
- Publication date Oct 6, 2011
- Gamal Refai-Ahmed
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip Thermal Interface Structures
- Publication number 20100327431
- Publication date Dec 30, 2010
- Maxat N. Touzelbaev
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Sink for a Circuit Device
- Publication number 20100328887
- Publication date Dec 30, 2010
- Gamal Refai-Ahmed
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thermal Interface Material with Support Structure
- Publication number 20100237496
- Publication date Sep 23, 2010
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void Reduction in Indium Thermal Interface Material
- Publication number 20100117222
- Publication date May 13, 2010
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Gel-Type Thermal Interface Material
- Publication number 20090057877
- Publication date Mar 5, 2009
- Maxat Touzelbaev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void Reduction in Indium Thermal Interface Material
- Publication number 20070284737
- Publication date Dec 13, 2007
- Seah Sun Too
- H01 - BASIC ELECTRIC ELEMENTS

Maxat Touzelbaev

Person

Patents Grantslast 30 patents

Performance state boost for multi-core integrated circuit

Stacked semiconductor chips with thermal management

Valley-fill power factor correction circuit with active conduction...

Thermal interface material with support structure

Computing center power and cooling control apparatus and method

Lid attach process

Transient thermal modeling of multisource power devices

Lid attach process

Semiconductor chip thermal interface structures

Thermal interface material with support structure

Void reduction in indium thermal interface material

Heat sink for a circuit device

Method for decreasing surface delamination of gel-type thermal inte...

Semiconductor device with gel-type thermal interface material

Void reduction in indium thermal interface material

Thermal transfer measurement of an integrated circuit

Feedforward temperature control of device under test

Voltage programmable power dissipater

Patents Applicationslast 30 patents

Valley-Fill Power Factor Correction Circuit with Active Conduction...

PERFORMANCE STATE BOOST FOR MULTI-CORE INTEGRATED CIRCUIT

LID ATTACH PROCESS

Transient Thermal Modeling of Multisource Power Devices

STACKED SEMICONDUCTOR CHIPS WITH THERMAL MANAGEMENT

THERMAL INTERFACE MATERIAL WITH SUPPORT STRUCTURE

COMPUTING CENTER POWER AND COOLING CONTROL APPARATUS AND METHOD

Semiconductor Chip Thermal Interface Structures

Heat Sink for a Circuit Device

Thermal Interface Material with Support Structure

Void Reduction in Indium Thermal Interface Material

Semiconductor Device with Gel-Type Thermal Interface Material

Void Reduction in Indium Thermal Interface Material