Maximilian Kaeser

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Mehring-Od, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for slicing a multiplicity of wafers from a crystal composed...
- Patent number 8,844,511
- Issue date Sep 30, 2014
- Siltronic AG
- Maximilian Kaeser
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Sawing wire and method for the cutting and lapping of hard brittle...
- Patent number 6,554,686
- Issue date Apr 29, 2003
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Maximilian Kaeser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cutting wafers from a crystal
- Patent number 5,947,102
- Issue date Sep 7, 1999
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Vernon Knepprath
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR SLICING A MULTIPLICITY OF WAFERS FROM A CRYSTAL COMPOSED...
- Publication number 20110192388
- Publication date Aug 11, 2011
- Siltronic AG
- Maximilian Kaeser
- B28 - WORKING CEMENT, CLAY, OR STONE