Maya Obata

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Ishioka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Plastic-molded-type semiconductor device and producing method therefor
- Patent number 5,295,045
- Issue date Mar 15, 1994
- Hitachi, Ltd.
- Makoto Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic encapsulated semiconductor device
- Patent number 5,256,903
- Issue date Oct 26, 1993
- Hitachi Ltd.
- Maya Obata
- H01 - BASIC ELECTRIC ELEMENTS