Mayank Mayukh

Person

Fort Collins, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cantilevered power planes to provide a return current path for high...
- Patent number 12,191,243
- Issue date Jan 7, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonics integration in semiconductor packages
- Patent number 11,906,802
- Issue date Feb 20, 2024
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF
- Publication number 20250046622
- Publication date Feb 6, 2025
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF
- Publication number 20250046690
- Publication date Feb 6, 2025
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR INTEGRATING THROUGH METAL CONTACTS AND FLU...
- Publication number 20250029890
- Publication date Jan 23, 2025
- Avago Technologies International Sales Pte. Limited
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonics Integration in Semiconductor Packages
- Publication number 20240151921
- Publication date May 9, 2024
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Application
Substrate with Differing Dielectric Constants
- Publication number 20240145392
- Publication date May 2, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic Channels for Cooling Hybrid Bonded Interfaces
- Publication number 20240128156
- Publication date Apr 18, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR METHOD AND APPARATUS
- Publication number 20240096745
- Publication date Mar 21, 2024
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Seal for Bonded Stacks of Different Size Semiconductor Devices
- Publication number 20240038613
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elastomer Interconnection Substrate Layer
- Publication number 20240038641
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Interconnection Structure
- Publication number 20240038645
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Antennas on Side Wall of 3D Stacked Die
- Publication number 20240039141
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Side Wall Interconnection
- Publication number 20240038724
- Publication date Feb 1, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed Dielectric Materials for Improving Signal Integrity of Integr...
- Publication number 20230395444
- Publication date Dec 7, 2023
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging Heterogeneous Area Array Interconnections
- Publication number 20230369267
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Sam Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonics Integration in Semiconductor Packages
- Publication number 20230367087
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- G02 - OPTICS
Information Patent Application
Cantilevered Power Planes to Provide a Return Current Path for High...
- Publication number 20230369191
- Publication date Nov 16, 2023
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Cores, Variable Width Vias, and Offset Vias
- Publication number 20230352383
- Publication date Nov 2, 2023
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SURFACE MODIFIED LIQUID METAL SPHER...
- Publication number 20230034217
- Publication date Feb 2, 2023
- Avago Technologies International Sales Pte. Limited
- Mayank Mayukh
- H01 - BASIC ELECTRIC ELEMENTS

Mayank Mayukh

Person

Patents Grantslast 30 patents

Cantilevered power planes to provide a return current path for high...

Photonics integration in semiconductor packages

Patents Applicationslast 30 patents

HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF

HYBRID SUBSTRATES AND MANUFACTURING METHODS THEREOF

STRUCTURE AND METHOD FOR INTEGRATING THROUGH METAL CONTACTS AND FLU...

Photonics Integration in Semiconductor Packages

Substrate with Differing Dielectric Constants

Microfluidic Channels for Cooling Hybrid Bonded Interfaces

STACKED SEMICONDUCTOR METHOD AND APPARATUS

Edge Seal for Bonded Stacks of Different Size Semiconductor Devices

Elastomer Interconnection Substrate Layer

Semiconductor Package Interconnection Structure

Integrated Antennas on Side Wall of 3D Stacked Die

Semiconductor Package with Side Wall Interconnection

Mixed Dielectric Materials for Improving Signal Integrity of Integr...

3D Packaging Heterogeneous Area Array Interconnections

Photonics Integration in Semiconductor Packages

Cantilevered Power Planes to Provide a Return Current Path for High...

Multilayer Cores, Variable Width Vias, and Offset Vias

INTEGRATED CIRCUIT PACKAGE WITH SURFACE MODIFIED LIQUID METAL SPHER...