Mayumi FUKUDA

Person

Tokushima-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Package including lead component having recess
- Patent number 11,043,623
- Issue date Jun 22, 2021
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing lead frame including electrode and hanger...
- Patent number 10,937,666
- Issue date Mar 2, 2021
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing lead frame, method for producing package and m...
- Patent number 10,886,448
- Issue date Jan 5, 2021
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and light emitting device
- Patent number 10,847,683
- Issue date Nov 24, 2020
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, package and light emitting device
- Patent number 10,600,944
- Issue date Mar 24, 2020
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package intermediate body
- Patent number 10,580,947
- Issue date Mar 3, 2020
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including lead component having recess
- Patent number 10,505,090
- Issue date Dec 10, 2019
- Nichia Corporation
- Mayumi Fukuda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Package and light emitting device
- Patent number 10,490,705
- Issue date Nov 26, 2019
- Nichia Corporation
- Mayumi Fukuda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lead frame including hanger lead, package, and light-emitting device
- Patent number 10,367,127
- Issue date Jul 30, 2019
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing package, method for manufacturing light em...
- Patent number 10,177,282
- Issue date Jan 8, 2019
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package manufacturing method, light emitting device manufacturing m...
- Patent number 10,079,332
- Issue date Sep 18, 2018
- Nichia Corporation
- Mayumi Fukuda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lead frame, package, light emitting device, and method for producin...
- Patent number 10,032,972
- Issue date Jul 24, 2018
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package, package intermediate body, light emitting device, method f...
- Patent number 9,954,151
- Issue date Apr 24, 2018
- Nichia Corporation
- Mayumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing package, method for manufacturing light em...
- Patent number 9,640,743
- Issue date May 2, 2017
- Nichia Corporation
- Mayumi Fukuda
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING LEAD FRAME, METHOD FOR PRODUCING PACKAGE AND M...
- Publication number 20200185583
- Publication date Jun 11, 2020
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING LEAD COMPONENT HAVING RECESS
- Publication number 20200075827
- Publication date Mar 5, 2020
- Nichia Corporation.
- Mayumi FUKUDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR MANUFACTURING LEAD FRAME, METHOD FOR MANUFACTURING PACKA...
- Publication number 20190296203
- Publication date Sep 26, 2019
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND LIGHT EMITTING DEVICE
- Publication number 20190109265
- Publication date Apr 11, 2019
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND LIGHT EMITTING DEVICE
- Publication number 20180342651
- Publication date Nov 29, 2018
- Nichia Corporation.
- Mayumi FUKUDA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LEAD FRAME, PACKAGE AND LIGHT EMITTING DEVICE
- Publication number 20180309037
- Publication date Oct 25, 2018
- Nichia Corporation
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND PACKAGE INTERMEDIATE BODY
- Publication number 20180204990
- Publication date Jul 19, 2018
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, PACKAGE, AND LIGHT-EMITTING DEVICE, AND METHODS FOR MAN...
- Publication number 20170288103
- Publication date Oct 5, 2017
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING LEAD COMPONENT HAVING RECESS
- Publication number 20170200878
- Publication date Jul 13, 2017
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MANUFACTURING METHOD, LIGHT EMITTING DEVICE MANUFACTURING M...
- Publication number 20170170367
- Publication date Jun 15, 2017
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE, METHOD FOR MANUFACTURING LIGHT EM...
- Publication number 20170170366
- Publication date Jun 15, 2017
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, PACKAGE INTERMEDIATE BODY, LIGHT EMITTING DEVICE, METHOD F...
- Publication number 20170155021
- Publication date Jun 1, 2017
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, PACKAGE, LIGHT EMITTING DEVICE, AND METHOD FOR PRODUCIN...
- Publication number 20170040516
- Publication date Feb 9, 2017
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE, METHOD FOR MANUFACTURING LIGHT EM...
- Publication number 20160093785
- Publication date Mar 31, 2016
- Nichia Corporation.
- Mayumi FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS

Mayumi FUKUDA

Person

Patents Grantslast 30 patents

Package including lead component having recess

Method for manufacturing lead frame including electrode and hanger...

Method for producing lead frame, method for producing package and m...

Package and light emitting device

Lead frame, package and light emitting device

Package and package intermediate body

Package including lead component having recess

Package and light emitting device

Lead frame including hanger lead, package, and light-emitting device

Method for manufacturing package, method for manufacturing light em...

Package manufacturing method, light emitting device manufacturing m...

Lead frame, package, light emitting device, and method for producin...

Package, package intermediate body, light emitting device, method f...

Method for manufacturing package, method for manufacturing light em...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING LEAD FRAME, METHOD FOR PRODUCING PACKAGE AND M...

PACKAGE INCLUDING LEAD COMPONENT HAVING RECESS

METHOD FOR MANUFACTURING LEAD FRAME, METHOD FOR MANUFACTURING PACKA...

PACKAGE AND LIGHT EMITTING DEVICE

PACKAGE AND LIGHT EMITTING DEVICE

LEAD FRAME, PACKAGE AND LIGHT EMITTING DEVICE

PACKAGE AND PACKAGE INTERMEDIATE BODY

LEAD FRAME, PACKAGE, AND LIGHT-EMITTING DEVICE, AND METHODS FOR MAN...

PACKAGE INCLUDING LEAD COMPONENT HAVING RECESS

PACKAGE MANUFACTURING METHOD, LIGHT EMITTING DEVICE MANUFACTURING M...

METHOD FOR MANUFACTURING PACKAGE, METHOD FOR MANUFACTURING LIGHT EM...

PACKAGE, PACKAGE INTERMEDIATE BODY, LIGHT EMITTING DEVICE, METHOD F...

LEAD FRAME, PACKAGE, LIGHT EMITTING DEVICE, AND METHOD FOR PRODUCIN...

METHOD FOR MANUFACTURING PACKAGE, METHOD FOR MANUFACTURING LIGHT EM...