Megha RAO

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Clifton Park, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for integration of through substrate vias
- Patent number 8,969,200
- Issue date Mar 3, 2015
- The Research Foundation of State University of New York
- Jeremiah Hebding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thin die-to-wafer bonding
- Patent number 8,697,542
- Issue date Apr 15, 2014
- The Research Foundation of State University of New York
- Daniel Pascual
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR INTEGRATION OF THROUGH SUBSTRATE VIAS
- Publication number 20130270711
- Publication date Oct 17, 2013
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- Jeremiah HEBDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR THIN DIE-TO-WAFER BONDING
- Publication number 20130273691
- Publication date Oct 17, 2013
- THE RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK
- Daniel PASCUAL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR