Megumi Maruyama

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of managing a plating liquid used in a plating apparatus
- Patent number 7,172,683
- Issue date Feb 6, 2007
- Ebara Corporation
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate plating method and apparatus
- Patent number 7,033,463
- Issue date Apr 25, 2006
- Ebara Corporation
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate plating method and apparatus
- Patent number 6,908,534
- Issue date Jun 21, 2005
- Ebara Corporation
- Akihisa Hongo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper plating bath and plating method for substrate using the copp...
- Patent number 6,800,188
- Issue date Oct 5, 2004
- Ebara-Udylite Co., Ltd.
- Hideki Hagiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of measuring the concentration of a leveler in a plating liquid
- Patent number 6,627,066
- Issue date Sep 30, 2003
- Ebara Corporation
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for plating a first layer on a substrate and a second layer...
- Patent number 6,517,894
- Issue date Feb 11, 2003
- Ebara Corporation
- Akihisa Hongo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus for managing a plating liquid
- Publication number 20070102285
- Publication date May 10, 2007
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating method and apparatus
- Publication number 20060144714
- Publication date Jul 6, 2006
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating method and apparatus
- Publication number 20050098439
- Publication date May 12, 2005
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of measuring the concentration of a leveler in a plating liq...
- Publication number 20040016644
- Publication date Jan 29, 2004
- Yasushi Isayama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper plating bath and plating method for substrate using the copp...
- Publication number 20030106802
- Publication date Jun 12, 2003
- Hideki Hagiwara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating method and apparatus
- Publication number 20020064591
- Publication date May 30, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR