Mei Chin Ng

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing a package using plateable encapsulant
- Patent number 11,081,417
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Sook Woon Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 10,490,470
- Issue date Nov 26, 2019
- Infineon Technologies AG
- Hock Heng Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having an optical inspection feature
- Patent number 10,431,560
- Issue date Oct 1, 2019
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plateable encapsulant and a method for m...
- Patent number 10,396,007
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Sook Woon Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing molded semiconductor packages having an opt...
- Patent number 9,806,043
- Issue date Oct 31, 2017
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package structure with glue bleed stopper for sealing a MEMs...
- Patent number 9,475,691
- Issue date Oct 25, 2016
- Infineon Technologies AG
- Kok Yau Chua
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded flip-clip semiconductor package
- Patent number 9,219,025
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame semiconductor packages and methods of formation thereof
- Patent number 8,951,841
- Issue date Feb 10, 2015
- Infineon Technologies AG
- Melissa Mei Ching Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Molded Semiconductor Package
- Publication number 20200006267
- Publication date Jan 2, 2020
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20190341324
- Publication date Nov 7, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor package and method for fabricating a semiconductor pa...
- Publication number 20180174935
- Publication date Jun 21, 2018
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Semiconductor Package Having an Optical Inspection Feature
- Publication number 20180033752
- Publication date Feb 1, 2018
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20170256472
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Manufacturing Molded Semiconductor Packages Having an Opt...
- Publication number 20170256509
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clip Frame Semiconductor Packages and Methods of Formation Thereof
- Publication number 20130249067
- Publication date Sep 26, 2013
- INFINEON TECHNOLOGIES AG
- Melissa Mei Ching Ng
- H01 - BASIC ELECTRIC ELEMENTS

Mei Chin Ng

Person

Patents Grantslast 30 patents

Manufacturing a package using plateable encapsulant

Semiconductor package and method for fabricating a semiconductor pa...

Molded semiconductor package having an optical inspection feature

Semiconductor package with plateable encapsulant and a method for m...

Method of manufacturing molded semiconductor packages having an opt...

Molded package structure with glue bleed stopper for sealing a MEMs...

Molded flip-clip semiconductor package

Clip frame semiconductor packages and methods of formation thereof

Patents Applicationslast 30 patents

Molded Semiconductor Package

Manufacturing a package using plateable encapsulant

Semiconductor package and method for fabricating a semiconductor pa...

Molded Semiconductor Package Having an Optical Inspection Feature

Manufacturing a package using plateable encapsulant

Method of Manufacturing Molded Semiconductor Packages Having an Opt...

Clip Frame Semiconductor Packages and Methods of Formation Thereof