Mei-Fang Peng

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 9,196,553
- Issue date Nov 24, 2015
- ChipMOS Technologies Inc.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure for solid-state light emitting device pa...
- Patent number 6,480,389
- Issue date Nov 12, 2002
- Opto Tech Corporation
- Jin-shown Shie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130049197
- Publication date Feb 28, 2013
- CHIPMOS TECHNOLOGIES INC.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130049198
- Publication date Feb 28, 2013
- CHIPMOS TECHNOLOGIES INC.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Phone voice receiving /playing device
- Publication number 20070121804
- Publication date May 31, 2007
- ARTDIO COMPANY INC.
- Mei-Lin Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE