Mei-Hui Fu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive feature structure including a blocking region
- Patent number 11,532,503
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for making
- Patent number 11,482,495
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure using bottom-up filling...
- Patent number 10,943,823
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 10,847,411
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect formation and structure
- Patent number 10,804,140
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and method of forming
- Patent number 10,756,017
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure using bottom-up filling...
- Patent number 10,475,702
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and method of forming
- Patent number 10,269,713
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and method of forming
- Patent number 9,831,183
- Issue date Nov 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 9,589,892
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 9,385,080
- Issue date Jul 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...
- Publication number 20240379433
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING
- Publication number 20220375863
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure Using Bottom-Up Filling...
- Publication number 20210193517
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20210074580
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING
- Publication number 20200176382
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure Using Bottom-Up Filling...
- Publication number 20200051858
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20190385904
- Publication date Dec 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure
- Publication number 20190304833
- Publication date Oct 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Feature Formation and Structure Using Bottom-Up Filling...
- Publication number 20190287851
- Publication date Sep 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure and Method of Forming
- Publication number 20190221522
- Publication date Jul 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure and Method of Forming
- Publication number 20180076144
- Publication date Mar 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming the Same
- Publication number 20160268192
- Publication date Sep 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming the Same
- Publication number 20160049362
- Publication date Feb 18, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure and Method of Forming
- Publication number 20160043035
- Publication date Feb 11, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Conductive feature structure including a blocking region

Semiconductor arrangement and method for making

Conductive feature formation and structure using bottom-up filling...

Conductive feature formation and structure

Interconnect formation and structure

Contact structure and method of forming

Conductive feature formation and structure using bottom-up filling...

Contact structure and method of forming

Contact structure and method of forming

Interconnect structure and method of forming the same

Interconnect structure and method of forming the same

Patents Applicationslast 30 patents

CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING

Conductive Feature Formation and Structure Using Bottom-Up Filling...

Conductive Feature Formation and Structure

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING

Conductive Feature Formation and Structure Using Bottom-Up Filling...

Conductive Feature Formation and Structure

Conductive Feature Formation and Structure

Conductive Feature Formation and Structure Using Bottom-Up Filling...

Contact Structure and Method of Forming

Contact Structure and Method of Forming

Interconnect Structure and Method of Forming the Same

Interconnect Structure and Method of Forming the Same

Contact Structure and Method of Forming