Mei Qi Tay

Follow

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Package with clip having through hole accommodating component-relat...
- Patent number 12,027,436
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Angela Kessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure with radial spokes for improved s...
- Patent number 11,355,429
- Issue date Jun 7, 2022
- Infineon Technologies AG
- Paul Armand Asentista Calo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH CLIP HAVING THROUGH HOLE ACCOMMODATING COMPONENT-RELAT...
- Publication number 20220254696
- Publication date Aug 11, 2022
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnect Structure with Radial Spokes for Improved S...
- Publication number 20210233839
- Publication date Jul 29, 2021
- Paul Armand Asentista Calo
- H01 - BASIC ELECTRIC ELEMENTS