Meifang Qin

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Branchburg, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Lasable bond-ply materials for high density printed wiring boards
- Patent number 6,673,190
- Issue date Jan 6, 2004
- Honeywell International Inc.
- David Haas
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lasable bond-ply materials for high density printed wiring boards
- Patent number 6,245,696
- Issue date Jun 12, 2001
- Honeywell International Inc.
- David R. Haas
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Lasable bond-ply materials for high density printed wiring boards
- Publication number 20040170795
- Publication date Sep 2, 2004
- AlliedSignal Inc.
- David R. Haas
- B32 - LAYERED PRODUCTS
Information Patent Application
Lasable bond-ply materials for high density printed wiring boards
- Publication number 20020004352
- Publication date Jan 10, 2002
- AlliedSignal, Inc.
- David Haas
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL