Meihua SHEN

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Film stack simplification for high aspect ratio patterning and vert...
- Patent number 12,080,592
- Issue date Sep 3, 2024
- Lam Research Corporation
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal damage-free encapsulation of chalcogenide materials
- Patent number 11,832,533
- Issue date Nov 28, 2023
- Lam Research Corporation
- James Samuel Sims
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned vertical integration of three-terminal memory devices
- Patent number 11,792,987
- Issue date Oct 17, 2023
- Lam Research Corporation
- Thorsten Lill
Information Patent Grant
Method and apparatus for reducing particle defects in plasma etch c...
- Patent number 11,488,812
- Issue date Nov 1, 2022
- Applied Materials, Inc.
- Xikun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal damage-free encapsulation of chalcogenide materials
- Patent number 11,239,420
- Issue date Feb 1, 2022
- Lam Research Corporation
- James Samuel Sims
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt etch back
- Patent number 10,784,086
- Issue date Sep 22, 2020
- Lam Research Corporation
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for reducing particle defects in plasma etch c...
- Patent number 10,658,161
- Issue date May 19, 2020
- Applied Materials, Inc.
- Xikun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ale smoothness: in and outside semiconductor industry
- Patent number 10,304,659
- Issue date May 28, 2019
- Lam Research Corporation
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liner and barrier applications for subtractive metal integration
- Patent number 10,199,235
- Issue date Feb 5, 2019
- Lam Research Corporation
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer etching of tungsten and other metals
- Patent number 10,096,487
- Issue date Oct 9, 2018
- Lam Research Corporation
- Wenbing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ALE smoothness: in and outside semiconductor industry
- Patent number 9,984,858
- Issue date May 29, 2018
- Lam Research Corporation
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chamber for patterning non-volatile metals
- Patent number 9,953,843
- Issue date Apr 24, 2018
- Lam Research Corporation
- Meihua Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liner and barrier applications for subtractive metal integration
- Patent number 9,899,234
- Issue date Feb 20, 2018
- Lam Research Corporation
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cobalt etch back
- Patent number 9,870,899
- Issue date Jan 16, 2018
- Lam Research Corporation
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Equipment front end module for transferring wafers and method of tr...
- Patent number 9,818,633
- Issue date Nov 14, 2017
- Lam Research Corporation
- Thorsten Lill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Residue free oxide etch
- Patent number 9,595,452
- Issue date Mar 14, 2017
- Lam Research Corporation
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing an upper surface of a semiconductor substrate...
- Patent number 9,589,853
- Issue date Mar 7, 2017
- Lam Research Corporation
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to etch copper barrier film
- Patent number 9,570,320
- Issue date Feb 14, 2017
- Lam Research Corporation
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for in-situ chamber clean utilized in an etching processing...
- Patent number 9,533,332
- Issue date Jan 3, 2017
- Applied Materials, Inc.
- Noel Sun
- B08 - CLEANING
Information Patent Grant
Isotropic atomic layer etch for silicon and germanium oxides
- Patent number 9,431,268
- Issue date Aug 30, 2016
- Lam Research Corporation
- Thorsten Lill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to etch non-volatile metal materials
- Patent number 9,391,267
- Issue date Jul 12, 2016
- Lam Research Corporation
- Meihua Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to etch non-volatile metal materials
- Patent number 9,257,638
- Issue date Feb 9, 2016
- Lam Research Corporation
- Samantha S.H. Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to etch non-volatile metal materials
- Patent number 9,130,158
- Issue date Sep 8, 2015
- Lam Research Corporation
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching high K dielectrics with high selectivity to oxide containin...
- Patent number 8,722,547
- Issue date May 13, 2014
- Applied Materials, Inc.
- Radhika Mani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for high temperature etching a high-K material gate structure
- Patent number 8,501,626
- Issue date Aug 6, 2013
- Applied Materials, Inc.
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shallow trench isolation etch process
- Patent number 8,133,817
- Issue date Mar 13, 2012
- Applied Materials, Inc.
- Hiroki Sasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device having a lanthanum-fa...
- Patent number 8,101,525
- Issue date Jan 24, 2012
- Applied Materials, Inc.
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative method for advanced CMOS logic gate etch applications
- Patent number 7,910,488
- Issue date Mar 22, 2011
- Applied Materials, Inc.
- Nicolas Gani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for etching flash memory gate stacks comprising h...
- Patent number 7,780,862
- Issue date Aug 24, 2010
- Applied Materials, Inc.
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for etching tungsten silicide overlying polysilicon particu...
- Patent number 7,754,610
- Issue date Jul 13, 2010
- Applied Materials, Inc.
- Kyeong-Tae Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20240387258
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION OF CHANNEL LAYER IN THREE-TERMINAL VERTICAL MEMORY STRUC...
- Publication number 20230143057
- Publication date May 11, 2023
- LAM RESEARCH CORPORATION
- John HOANG
Information Patent Application
CONFORMAL DAMAGE-FREE ENCAPSULATION OF CHALCOGENIDE MATERIALS
- Publication number 20220115592
- Publication date Apr 14, 2022
- LAM RESEARCH CORPORATION
- James Samuel Sims
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20220051938
- Publication date Feb 17, 2022
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED VERTICAL INTEGRATION OF THREE-TERMINAL MEMORY DEVICES
- Publication number 20210391355
- Publication date Dec 16, 2021
- LAM RESEARCH CORPORATION
- Thorsten LILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL DAMAGE-FREE ENCAPSULATION OF CHALCOGENIDE MATERIALS
- Publication number 20200066987
- Publication date Feb 27, 2020
- LAM RESEARCH CORPORATION
- James Samuel Sims
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR REDUCING PARTICLE DEFECTS IN PLASMA ETCH C...
- Publication number 20190295826
- Publication date Sep 26, 2019
- Applied Materials, Inc.
- Xikun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALE SMOOTHNESS: IN AND OUTSIDE SEMICONDUCTOR INDUSTRY
- Publication number 20180233325
- Publication date Aug 16, 2018
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION
- Publication number 20180211846
- Publication date Jul 26, 2018
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHAMBER FOR PATTERNING NON-VOLATILE METALS
- Publication number 20180204738
- Publication date Jul 19, 2018
- LAM RESEARCH CORPORATION
- Meihua Shen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COBALT ETCH BACK
- Publication number 20180102236
- Publication date Apr 12, 2018
- LAM RESEARCH CORPORATION
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBER FOR PATTERNING NON-VOLATILE METALS
- Publication number 20170229317
- Publication date Aug 10, 2017
- LAM RESEARCH CORPORATION
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALE SMOOTHNESS: IN AND OUTSIDE SEMICONDUCTOR INDUSTRY
- Publication number 20170069462
- Publication date Mar 9, 2017
- LAM RESEARCH CORPORATION
- Keren Jacobs Kanarik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN AND OTHER METALS
- Publication number 20170053810
- Publication date Feb 23, 2017
- LAM RESEARCH CORPORATION
- Wenbing Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ETCH RATE AND CRITICAL DIMENSION UNIFORMITY BY SELECTION OF FOCUS R...
- Publication number 20170011891
- Publication date Jan 12, 2017
- Applied Materials, Inc.
- Edward P. HAMMOND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIDUE FREE OXIDE ETCH
- Publication number 20160351418
- Publication date Dec 1, 2016
- LAM RESEARCH CORPORATION
- Chih-Hsun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT ETCH BACK
- Publication number 20160314985
- Publication date Oct 27, 2016
- LAM RESEARCH CORPORATION
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOTROPIC ATOMIC LAYER ETCH FOR SILICON AND GERMANIUM OXIDES
- Publication number 20160196984
- Publication date Jul 7, 2016
- LAM RESEARCH CORPORATION
- Thorsten Lill
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EQUIPMENT FRONT END MODULE FOR TRANSFERRING WAFERS AND METHOD OF TR...
- Publication number 20160111309
- Publication date Apr 21, 2016
- LAM RESEARCH CORPORATION
- Thorsten Lill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD TO ETCH COPPER BARRIER FILM
- Publication number 20160104630
- Publication date Apr 14, 2016
- LAM RESEARCH CORPORATION
- Meihua SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION
- Publication number 20150380272
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD TO ETCH NON-VOLATILE METAL MATERIALS
- Publication number 20150340603
- Publication date Nov 26, 2015
- LAM RESEARCH CORPORATION
- Meihua SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ETCH NON-VOLATILE METAL MATERIALS
- Publication number 20150280114
- Publication date Oct 1, 2015
- LAM RESEARCH CORPORATION
- Meihua SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ETCH NON-VOLATILE METAL MATERIALS
- Publication number 20150280113
- Publication date Oct 1, 2015
- LAM RESEARCH CORPORATION
- Samantha S.H. TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PLANARIZING AN UPPER SURFACE OF A SEMICONDUCTOR SUBSTRATE...
- Publication number 20150249016
- Publication date Sep 3, 2015
- LAM RESEARCH CORPORATION
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR HIGH TEMPERATURE ETCHING A HIGH-K GATE STRUCTURE
- Publication number 20130344701
- Publication date Dec 26, 2013
- Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IN-SITU CHAMBER CLEAN UTILIZED IN AN ETCHING PROCESSING...
- Publication number 20130087174
- Publication date Apr 11, 2013
- Applied Materials, Inc.
- Noel Sun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR REDUCING PARTICLE DEFECTS IN PLASMA ETCH C...
- Publication number 20120091095
- Publication date Apr 19, 2012
- Applied Materials, Inc.
- Xikun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING SUBSTRATES USING PULSED DC VOLTAGE
- Publication number 20120088371
- Publication date Apr 12, 2012
- Applied Materials, Inc.
- ALOK RANJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE HAVING A LANTHANUM-FA...
- Publication number 20100210112
- Publication date Aug 19, 2010
- Applied Materials, Inc.
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS

Meihua SHEN

Person

Patents Grantslast 30 patents

Film stack simplification for high aspect ratio patterning and vert...

Conformal damage-free encapsulation of chalcogenide materials

Self-aligned vertical integration of three-terminal memory devices

Method and apparatus for reducing particle defects in plasma etch c...

Conformal damage-free encapsulation of chalcogenide materials

Cobalt etch back

Method and apparatus for reducing particle defects in plasma etch c...

Ale smoothness: in and outside semiconductor industry

Liner and barrier applications for subtractive metal integration

Atomic layer etching of tungsten and other metals

ALE smoothness: in and outside semiconductor industry

Chamber for patterning non-volatile metals

Liner and barrier applications for subtractive metal integration

Cobalt etch back

Equipment front end module for transferring wafers and method of tr...

Residue free oxide etch

Method of planarizing an upper surface of a semiconductor substrate...

Method to etch copper barrier film

Methods for in-situ chamber clean utilized in an etching processing...

Isotropic atomic layer etch for silicon and germanium oxides

Method to etch non-volatile metal materials

Method to etch non-volatile metal materials

Method to etch non-volatile metal materials

Etching high K dielectrics with high selectivity to oxide containin...

Methods for high temperature etching a high-K material gate structure

Shallow trench isolation etch process

Method for fabricating a semiconductor device having a lanthanum-fa...

Alternative method for advanced CMOS logic gate etch applications

Device and method for etching flash memory gate stacks comprising h...

Process for etching tungsten silicide overlying polysilicon particu...

Patents Applicationslast 30 patents

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

PROTECTION OF CHANNEL LAYER IN THREE-TERMINAL VERTICAL MEMORY STRUC...

CONFORMAL DAMAGE-FREE ENCAPSULATION OF CHALCOGENIDE MATERIALS

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

SELF-ALIGNED VERTICAL INTEGRATION OF THREE-TERMINAL MEMORY DEVICES

CONFORMAL DAMAGE-FREE ENCAPSULATION OF CHALCOGENIDE MATERIALS

METHOD AND APPARATUS FOR REDUCING PARTICLE DEFECTS IN PLASMA ETCH C...

ALE SMOOTHNESS: IN AND OUTSIDE SEMICONDUCTOR INDUSTRY

LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION

CHAMBER FOR PATTERNING NON-VOLATILE METALS

COBALT ETCH BACK

CHAMBER FOR PATTERNING NON-VOLATILE METALS

ALE SMOOTHNESS: IN AND OUTSIDE SEMICONDUCTOR INDUSTRY

ATOMIC LAYER ETCHING OF TUNGSTEN AND OTHER METALS

ETCH RATE AND CRITICAL DIMENSION UNIFORMITY BY SELECTION OF FOCUS R...

RESIDUE FREE OXIDE ETCH

COBALT ETCH BACK

ISOTROPIC ATOMIC LAYER ETCH FOR SILICON AND GERMANIUM OXIDES

EQUIPMENT FRONT END MODULE FOR TRANSFERRING WAFERS AND METHOD OF TR...

NOVEL METHOD TO ETCH COPPER BARRIER FILM

LINER AND BARRIER APPLICATIONS FOR SUBTRACTIVE METAL INTEGRATION

METHOD TO ETCH NON-VOLATILE METAL MATERIALS

METHOD TO ETCH NON-VOLATILE METAL MATERIALS

METHOD TO ETCH NON-VOLATILE METAL MATERIALS

METHOD OF PLANARIZING AN UPPER SURFACE OF A SEMICONDUCTOR SUBSTRATE...

METHODS FOR HIGH TEMPERATURE ETCHING A HIGH-K GATE STRUCTURE

METHODS FOR IN-SITU CHAMBER CLEAN UTILIZED IN AN ETCHING PROCESSING...

METHOD AND APPARATUS FOR REDUCING PARTICLE DEFECTS IN PLASMA ETCH C...

METHODS FOR ETCHING SUBSTRATES USING PULSED DC VOLTAGE

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE HAVING A LANTHANUM-FA...