Meijiang Song

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame with selective patterned plating
- Patent number 10,847,449
- Issue date Nov 24, 2020
- NXP USA, INC.
- Meijiang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper ball bond interface structure and formation
- Patent number 9,257,403
- Issue date Feb 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with solder flow control
- Patent number 8,050,048
- Issue date Nov 1, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Xuesong Xu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME WITH SELECTIVE PATTERNED PLATING
- Publication number 20200203258
- Publication date Jun 25, 2020
- NXP USA, Inc.
- Meijiang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Ball Bond Interface Structure and Formation
- Publication number 20150145148
- Publication date May 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR SEMICONDUCTOR DEVICE
- Publication number 20100283135
- Publication date Nov 11, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinzhong YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH SOLDER FLOW CONTROL
- Publication number 20080266828
- Publication date Oct 30, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Xuesong XU
- H01 - BASIC ELECTRIC ELEMENTS