Meiyee Shek

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Prevention and reduction of solvent and solution penetration into p...
- Patent number 8,236,684
- Issue date Aug 7, 2012
- Applied Materials, Inc.
- Kelvin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus of creating airgap in dielectric layers for t...
- Patent number 7,879,683
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Amir Al-Bayati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature conformal oxide formation and applications
- Patent number 7,851,385
- Issue date Dec 14, 2010
- Applied Materials, Inc.
- Matthew Spuller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reduction of hillocks prior to dielectric barrier deposition in Cu...
- Patent number 7,723,228
- Issue date May 25, 2010
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective copper-silicon-nitride layer formation for an improved di...
- Patent number 7,718,548
- Issue date May 18, 2010
- Applied Materials, Inc.
- Sang M. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve the step coverage and pattern loading for dielect...
- Patent number 7,601,651
- Issue date Oct 13, 2009
- Applied Materials, Inc.
- Mihaela Balseanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of hillocks prior to dielectric barrier deposition in Cu...
- Patent number 7,371,427
- Issue date May 13, 2008
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion improvement for low k dielectrics to conductive materials
- Patent number 7,229,911
- Issue date Jun 12, 2007
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming silicon containing layers on a substrate
- Patent number 6,656,840
- Issue date Dec 2, 2003
- Applied Materials Inc.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220230887
- Publication date Jul 21, 2022
- Meiyee SHEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION IMPROVEMENT OF DIELECTRIC BARRIER TO COPPER BY THE ADDITIO...
- Publication number 20120276301
- Publication date Nov 1, 2012
- Yong-Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION AND REDUCTION OF SOLVENT AND SOLUTION PENETRATION INTO P...
- Publication number 20120208366
- Publication date Aug 16, 2012
- Applied Materials, Inc.
- KELVIN CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPROVE THE STEP COVERAGE AND PATTERN LOADING FOR DIELECT...
- Publication number 20100048030
- Publication date Feb 25, 2010
- Applied Materials, Inc.
- MIHAELA BALSEANU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION AND REDUCTION OF SOLVENT AND SOLUTION PENETRATION INTO P...
- Publication number 20090325381
- Publication date Dec 31, 2009
- APPLIED MATERIALS, INC.
- KELVIN CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CRITICAL DIMENSION SHRINK USING CONFORMAL PECVD FILMS
- Publication number 20090286402
- Publication date Nov 19, 2009
- Applied Materials, Inc.
- Li-Qun Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION AND ELECTROMIGRATION IMPROVEMENT BETWEEN DIELECTRIC AND CO...
- Publication number 20090269923
- Publication date Oct 29, 2009
- Sang M. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION IMPROVEMENT OF DIELECTRIC BARRIER TO COPPER BY THE ADDITIO...
- Publication number 20090107626
- Publication date Apr 30, 2009
- APPLIED MATERIALS, INC.
- Yong-Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS OF CREATING AIRGAP IN DIELECTRIC LAYERS FOR T...
- Publication number 20090093112
- Publication date Apr 9, 2009
- APPLIED MATERIALS, INC.
- AMIR AL-BAYATI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN AIR GAP IN MULTILEVEL INTERCONNECT STRUCTURE
- Publication number 20090093100
- Publication date Apr 9, 2009
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW TEMPERATURE CONFORMAL OXIDE FORMATION AND APPLICATIONS
- Publication number 20090087977
- Publication date Apr 2, 2009
- APPLIED MATERIALS, INC.
- MATTHEW SPULLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and apparatuses promoting adhesion of dielectric barrier fi...
- Publication number 20090011148
- Publication date Jan 8, 2009
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE COPPER-SILICON-NITRIDE LAYER FORMATION FOR AN IMPROVED DI...
- Publication number 20080213997
- Publication date Sep 4, 2008
- Applied Materials, Inc.
- Sang M. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF HILLOCKS PRIOR TO DIELECTRIC BARRIER DEPOSITION IN CU...
- Publication number 20080075888
- Publication date Mar 27, 2008
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD TO IMPROVE THE STEP COVERAGE AND PATTERN LOADING FOR DIELECT...
- Publication number 20070232082
- Publication date Oct 4, 2007
- Mihaela Balseanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion improvement for low k dielectrics to conductive materials
- Publication number 20060046479
- Publication date Mar 2, 2006
- APPLIED MATERIALS, INC.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Adhesion improvement for low k dielectrics to conductive materials
- Publication number 20050233555
- Publication date Oct 20, 2005
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods and apparatuses promoting adhesion of dielectric barrier fi...
- Publication number 20050186339
- Publication date Aug 25, 2005
- APPLIED MATERIALS, INC., A Delaware corporation
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reduction of hillocks prior to dielectric barrier deposition in Cu...
- Publication number 20040231795
- Publication date Nov 25, 2004
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reduction of hillocks prior to dielectric barrier deposition in Cu...
- Publication number 20040235292
- Publication date Nov 25, 2004
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SILICON CONTAINING LAYERS ON A SUBSTRATE
- Publication number 20030203614
- Publication date Oct 30, 2003
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Meiyee Shek

Person

Patents Grantslast 30 patents

Prevention and reduction of solvent and solution penetration into p...

Methods and apparatus of creating airgap in dielectric layers for t...

Low temperature conformal oxide formation and applications

Reduction of hillocks prior to dielectric barrier deposition in Cu...

Selective copper-silicon-nitride layer formation for an improved di...

Method to improve the step coverage and pattern loading for dielect...

Reduction of hillocks prior to dielectric barrier deposition in Cu...

Adhesion improvement for low k dielectrics to conductive materials

Method for forming silicon containing layers on a substrate

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

ADHESION IMPROVEMENT OF DIELECTRIC BARRIER TO COPPER BY THE ADDITIO...

PREVENTION AND REDUCTION OF SOLVENT AND SOLUTION PENETRATION INTO P...

METHOD TO IMPROVE THE STEP COVERAGE AND PATTERN LOADING FOR DIELECT...

PREVENTION AND REDUCTION OF SOLVENT AND SOLUTION PENETRATION INTO P...

METHOD FOR CRITICAL DIMENSION SHRINK USING CONFORMAL PECVD FILMS

ADHESION AND ELECTROMIGRATION IMPROVEMENT BETWEEN DIELECTRIC AND CO...

ADHESION IMPROVEMENT OF DIELECTRIC BARRIER TO COPPER BY THE ADDITIO...

METHODS AND APPARATUS OF CREATING AIRGAP IN DIELECTRIC LAYERS FOR T...

METHOD FOR FORMING AN AIR GAP IN MULTILEVEL INTERCONNECT STRUCTURE

LOW TEMPERATURE CONFORMAL OXIDE FORMATION AND APPLICATIONS

Methods and apparatuses promoting adhesion of dielectric barrier fi...

SELECTIVE COPPER-SILICON-NITRIDE LAYER FORMATION FOR AN IMPROVED DI...

REDUCTION OF HILLOCKS PRIOR TO DIELECTRIC BARRIER DEPOSITION IN CU...

METHOD TO IMPROVE THE STEP COVERAGE AND PATTERN LOADING FOR DIELECT...

Adhesion improvement for low k dielectrics to conductive materials

Adhesion improvement for low k dielectrics to conductive materials

Methods and apparatuses promoting adhesion of dielectric barrier fi...

Reduction of hillocks prior to dielectric barrier deposition in Cu...

Reduction of hillocks prior to dielectric barrier deposition in Cu...

METHOD FOR FORMING SILICON CONTAINING LAYERS ON A SUBSTRATE