Melissa A. Workman

Follow

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer packaging and singulation method
- Patent number 7,196,410
- Issue date Mar 27, 2007
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer packaging and singulation method
- Patent number 7,026,189
- Issue date Apr 11, 2006
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Wafer packaging and singulation method
- Publication number 20060128064
- Publication date Jun 15, 2006
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer packaging and singulation method
- Publication number 20050176166
- Publication date Aug 11, 2005
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY