Melissa E. Grupen-Shemansky

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Nonconductive laminate for coupling substrates and method therefor
- Patent number 6,482,289
- Issue date Nov 19, 2002
- Motorola, Inc.
- Treliant Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for coupling substrates and structure
- Patent number 6,022,761
- Issue date Feb 8, 2000
- Motorola, Inc.
- Melissa E. Grupen-Shemansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding silicon and III-V semiconductor materials
- Patent number 5,346,848
- Issue date Sep 13, 1994
- Motorola, Inc.
- Melissa E. Grupen-Shemansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thinning a semiconductor wafer
- Patent number 5,268,065
- Issue date Dec 7, 1993
- Motorola, Inc.
- Melissa E. Grupen-Shemansky
- H01 - BASIC ELECTRIC ELEMENTS