Men San Lung

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Hsinchu Hsien, TW

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Patents Applicationslast 30 patents

Information Patent Application
Method for re-forming BGA of a semiconductor package
- Publication number 20070049000
- Publication date Mar 1, 2007
- Jay Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Jig structure for manufacturin a stacked memory card
- Publication number 20070029655
- Publication date Feb 8, 2007
- Hong Tsu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked memory card and method for manufacturing the same
- Publication number 20060289980
- Publication date Dec 28, 2006
- Hong Tsu Chang
- H01 - BASIC ELECTRIC ELEMENTS