Meng-Che Lee

Person

Tai-Chung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of electronic package having embedded package block
- Patent number 10,199,331
- Issue date Feb 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Meng-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of packaging substrate
- Patent number 10,192,838
- Issue date Jan 29, 2019
- Siliconware Precision Industries Co., Ltd.
- Chien-Lung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of wafer level packaging semiconductor package w...
- Patent number 10,049,955
- Issue date Aug 14, 2018
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, semiconductor package and fabrication method thereof
- Patent number 9,899,237
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive vias
- Patent number 9,875,981
- Issue date Jan 23, 2018
- Siliconware Precision Industries Co., Ltd.
- Meng-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package having semiconductor el...
- Patent number 9,812,340
- Issue date Nov 7, 2017
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive vias
- Patent number 9,502,333
- Issue date Nov 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Meng-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,324,585
- Issue date Apr 26, 2016
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,041,189
- Issue date May 26, 2015
- Siliconware Precision Industries Co., Ltd.
- Meng-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 8,866,293
- Issue date Oct 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, semiconductor package and fabrication method thereof
- Patent number 8,680,692
- Issue date Mar 25, 2014
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a patterned structure of a semiconductor device
- Patent number 8,524,608
- Issue date Sep 3, 2013
- United Microelectronics Corp.
- Lung-En Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250138262
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Meng-Jie LEE
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062299
- Publication date Feb 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Meng-Jie LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145455
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Meng-Jie LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF ELECTRONIC PACKAGE HAVING EMBEDDED PACKAGE BLOCK
- Publication number 20180158784
- Publication date Jun 7, 2018
- Siliconware Precision Industries Co., Ltd.
- Meng-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170229364
- Publication date Aug 10, 2017
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20170133337
- Publication date May 11, 2017
- Siliconware Precision Industries Co., Ltd.
- Chien-Lung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20170077047
- Publication date Mar 16, 2017
- Siliconware Precision Industries Co., Ltd.
- Meng-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIAS
- Publication number 20170040277
- Publication date Feb 9, 2017
- Siliconware Precision Industries Co., Ltd.
- Meng-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20160196990
- Publication date Jul 7, 2016
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20150072517
- Publication date Mar 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE VIAS
- Publication number 20140252603
- Publication date Sep 11, 2014
- Siliconware Precision Industries Co., Ltd.
- Meng-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140154842
- Publication date Jun 5, 2014
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140021629
- Publication date Jan 23, 2014
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140015125
- Publication date Jan 16, 2014
- Siliconware Precision Industries Co., Ltd.
- Meng-Tsung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130341774
- Publication date Dec 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130228915
- Publication date Sep 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130187285
- Publication date Jul 25, 2013
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20130113095
- Publication date May 9, 2013
- Siliconware Precision Industries Co., Ltd.
- Chien-Lung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120280384
- Publication date Nov 8, 2012
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN APERTURE
- Publication number 20100317195
- Publication date Dec 16, 2010
- Chih-Wen Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE CAPABLE OF PROCESSING USB DATA
- Publication number 20040130505
- Publication date Jul 8, 2004
- Meng-Che Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Meng-Che Lee

Person

Patents Grantslast 30 patents

Fabrication method of electronic package having embedded package block

Fabrication method of packaging substrate

Fabrication method of wafer level packaging semiconductor package w...

Carrier, semiconductor package and fabrication method thereof

Semiconductor device having conductive vias

Method of fabricating semiconductor package having semiconductor el...

Semiconductor device having conductive vias

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor structure and fabrication method thereof

Carrier, semiconductor package and fabrication method thereof

Method for fabricating a patterned structure of a semiconductor device

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

FABRICATION METHOD OF ELECTRONIC PACKAGE HAVING EMBEDDED PACKAGE BLOCK

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

FABRICATION METHOD OF PACKAGING SUBSTRATE

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE VIAS

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE VIAS

CARRIER, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

CARRIER, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING AN APERTURE

DISPLAY DEVICE CAPABLE OF PROCESSING USB DATA