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Meng-Che Tu

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  • Hsinchu, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD OF MANUFACTURING DEVICE DIE
    • Publication number 20250062224
    • Publication date Feb 20, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Che Tu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHO...
    • Publication number 20250054826
    • Publication date Feb 13, 2025
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Che Tu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240186257
    • Publication date Jun 6, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Che TU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LITHOGRAPHY
    • Publication number 20240126174
    • Publication date Apr 18, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Che Tu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Package and Methods of Forming the Same
    • Publication number 20230377975
    • Publication date Nov 23, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Meng-Che Tu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LITHOGRAPHY
    • Publication number 20230062234
    • Publication date Mar 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Che Tu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230013491
    • Publication date Jan 19, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Che Tu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT COOLING POWER SEMICONDUCTOR PACKAGE
    • Publication number 20210358833
    • Publication date Nov 18, 2021
    • Lite-On Semiconductor Corporation
    • Chung Hsing Tzu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED FAN-OUT PACKAGE
    • Publication number 20210020575
    • Publication date Jan 21, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Meng-Che Tu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDCUTOR DEVICES AND METHODS OF FORMING THE SAME
    • Publication number 20200286832
    • Publication date Sep 10, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Sih-Hao Liao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME
    • Publication number 20200135567
    • Publication date Apr 30, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Meng-Che Tu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDCUTOR DEVICES, SEMICONDCUTOR PACKAGES AND METHODS OF FORMIN...
    • Publication number 20200091073
    • Publication date Mar 19, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Sih-Hao Liao
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...