Meng-Chi Hung

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Douliou City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Bonding pad structure
- Patent number 7,233,075
- Issue date Jun 19, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming copper fuse links
- Patent number 7,148,089
- Issue date Dec 12, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure
- Patent number 7,057,296
- Issue date Jun 6, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bonding pad structure
- Publication number 20060131759
- Publication date Jun 22, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming copper fuse links
- Publication number 20050189612
- Publication date Sep 1, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding pad structure
- Publication number 20050093176
- Publication date May 5, 2005
- Meng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS