Meng Chu Tseng

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Seed layers for copper interconnects
- Patent number 10,847,463
- Issue date Nov 24, 2020
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Utilization of SiH4 soak and purge in deposition processes
- Patent number 6,193,813
- Issue date Feb 27, 2001
- Applied Materials, Inc.
- Meng Chu Tseng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate having uniform tungsten silicide film and method of manuf...
- Patent number 5,997,950
- Issue date Dec 7, 1999
- Applied Materials, Inc.
- Susan G. Telford
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Utilization of SiH.sub.4 soak and purge in deposition processes
- Patent number 5,817,576
- Issue date Oct 6, 1998
- Applied Materials, Inc.
- Meng Chu Tseng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Uniform tungsten silicide films produced by chemical vapor depostiton
- Patent number 5,643,633
- Issue date Jul 1, 1997
- Applied Materials, Inc.
- Susan G. Telford
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for forming tungsten silicide on semiconductor wafer using...
- Patent number 5,565,382
- Issue date Oct 15, 1996
- Applied Materials, Inc.
- Meng C. Tseng
- C30 - CRYSTAL GROWTH
Information Patent Grant
Uniform tungsten silicide films produced by chemical vapor deposition
- Patent number 5,558,910
- Issue date Sep 24, 1996
- Applied Materials, Inc.
- Susan G. Telford
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Uniform tungsten silicide films produced by chemical vapor deposition
- Patent number 5,500,249
- Issue date Mar 19, 1996
- Applied Materials, Inc.
- Susan G. Telford
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Clamping ring and susceptor therefor
- Patent number 5,326,725
- Issue date Jul 5, 1994
- Applied Materials, Inc.
- Semyon Sherstinsky
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEED LAYERS FOR COPPER INTERCONNECTS
- Publication number 20190067201
- Publication date Feb 28, 2019
- Applied Materials, Inc.
- Zhiyuan WU
- H01 - BASIC ELECTRIC ELEMENTS

Meng Chu Tseng

Person

Patents Grantslast 30 patents

Seed layers for copper interconnects

Utilization of SiH4 soak and purge in deposition processes

Substrate having uniform tungsten silicide film and method of manuf...

Utilization of SiH.sub.4 soak and purge in deposition processes

Uniform tungsten silicide films produced by chemical vapor depostiton

Process for forming tungsten silicide on semiconductor wafer using...

Uniform tungsten silicide films produced by chemical vapor deposition

Uniform tungsten silicide films produced by chemical vapor deposition

Clamping ring and susceptor therefor

Patents Applicationslast 30 patents

SEED LAYERS FOR COPPER INTERCONNECTS