Meng-Da Chou

Person

Hsin-chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Contact formation with reduced dopant loss and increased dimensions
- Patent number 12,199,156
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing spacing between conductive features through implantation
- Patent number 12,112,977
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 11,973,027
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a FinFET by implanting a dielectric with a...
- Patent number 11,901,455
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition window enlargement
- Patent number 11,742,210
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing spacing between conductive features through implantation
- Patent number 11,615,982
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 11,502,000
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact plug with an air gap spacer
- Patent number 11,456,383
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 11,289,417
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating conductive bump of circuit board
- Patent number 7,341,934
- Issue date Mar 11, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20240387180
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387669
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Syuan SIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING SPACING BETWEEN CONDUCTIVE FEATURES THROUGH IMPLANTATION
- Publication number 20240363399
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20240274527
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Complementary Field Effect Transistors and Methods of Forming the Same
- Publication number 20240258387
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Syuan Siao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240154010
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A FINFET BY IMPLANTING A DIELECTRIC WITH A...
- Publication number 20240145596
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20230369055
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor Source/Drain Contacts and Methods of Forming the Same
- Publication number 20230261069
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Spacing Between Conductive Features Through Implantation
- Publication number 20230253243
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Formation with Reduced Dopant Loss and Increased Dimensions
- Publication number 20230034803
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20220406655
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET DEVICE AND METHOD
- Publication number 20220359755
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom Lateral Expansion of Contact Plugs Through Implantation
- Publication number 20220359286
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Spacing Between Conductive Features Through Implantation
- Publication number 20220230911
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20220216147
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom Lateral Expansion of Contact Plugs Through Implantation
- Publication number 20220059405
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition Window Enlargement
- Publication number 20210407808
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20210098365
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET DEVICE AND METHOD
- Publication number 20210066500
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating conductive bump of circuit board
- Publication number 20060051952
- Publication date Mar 9, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for releasing stress of embedded chip and chip embedded stru...
- Publication number 20050239269
- Publication date Oct 27, 2005
- Phoenix Precision Technology Corporation
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS

Meng-Da Chou

Person

Patents Grantslast 30 patents

Contact formation with reduced dopant loss and increased dimensions

Bottom lateral expansion of contact plugs through implantation

Reducing spacing between conductive features through implantation

Semiconductor device and methods of forming the same

Method of manufacturing a FinFET by implanting a dielectric with a...

Deposition window enlargement

Reducing spacing between conductive features through implantation

Bottom lateral expansion of contact plugs through implantation

Semiconductor device having a contact plug with an air gap spacer

Semiconductor device and methods of forming the same

Method for fabricating conductive bump of circuit board

Patents Applicationslast 30 patents

DEPOSITION WINDOW ENLARGEMENT

INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

REDUCING SPACING BETWEEN CONDUCTIVE FEATURES THROUGH IMPLANTATION

METHODS OF FORMING SEMICONDUCTOR DEVICE

Complementary Field Effect Transistors and Methods of Forming the Same

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

METHOD OF MANUFACTURING A FINFET BY IMPLANTING A DIELECTRIC WITH A...

DEPOSITION WINDOW ENLARGEMENT

Transistor Source/Drain Contacts and Methods of Forming the Same

Reducing Spacing Between Conductive Features Through Implantation

Contact Formation with Reduced Dopant Loss and Increased Dimensions

Semiconductor Devices and Methods of Manufacture

FINFET DEVICE AND METHOD

Bottom Lateral Expansion of Contact Plugs Through Implantation

Reducing Spacing Between Conductive Features Through Implantation

SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME

Bottom Lateral Expansion of Contact Plugs Through Implantation

Deposition Window Enlargement

SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME

FINFET DEVICE AND METHOD

Method for fabricating conductive bump of circuit board

Method for releasing stress of embedded chip and chip embedded stru...