Meng How Chong

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Melaka, MY

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A DIE PAD AND AN ENCAPSULATION WITH TR...
- Publication number 20240387305
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Meng How Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A POWER SEMI...
- Publication number 20220115245
- Publication date Apr 14, 2022
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Lead Design with Grooves for Improved Dambar Separation
- Publication number 20210013135
- Publication date Jan 14, 2021
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS