Meng-Hsun Wan

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,587,910
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 11,037,909
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for image sensor packaging
- Patent number 10,930,699
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 10,510,730
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated photodiode with a stacked scheme
- Patent number 10,510,791
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for image sensor packaging
- Patent number 10,475,843
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 10,157,889
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor chips with stacked scheme and methods for forming...
- Patent number 10,090,349
- Issue date Oct 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated photodiode with a stacked scheme
- Patent number 10,062,721
- Issue date Aug 28, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semicondcutor structure and method
- Patent number 9,716,078
- Issue date Jul 25, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated photodiode with a stacked scheme
- Patent number 9,530,811
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming pixel units of image sensors through bonding two chips
- Patent number 9,443,836
- Issue date Sep 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated photodiodes with crosstalk isolation
- Patent number 9,368,545
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for image sensor packaging
- Patent number 9,337,235
- Issue date May 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 9,257,414
- Issue date Feb 9, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with a high fill-factor
- Patent number 9,153,565
- Issue date Oct 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated photodiode with a stacked scheme
- Patent number 9,123,617
- Issue date Sep 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor chips with stacked scheme and methods for forming...
- Patent number 8,957,358
- Issue date Feb 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for image sensor packaging
- Patent number 8,946,784
- Issue date Feb 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated photodiodes with crosstalk isolation
- Patent number 8,933,527
- Issue date Jan 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elevated photodiode with a stacked scheme
- Patent number 8,878,325
- Issue date Nov 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20230207530
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20210225813
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20200075556
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Image Sensor Packaging
- Publication number 20200035743
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20190123026
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevated Photodiode with a Stacked Scheme
- Publication number 20190013345
- Publication date Jan 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20170323869
- Publication date Nov 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevated Photodiode with a Stacked Scheme
- Publication number 20170092679
- Publication date Mar 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Image Sensor Packaging
- Publication number 20160254306
- Publication date Sep 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semicondcutor Structure and Method
- Publication number 20160155725
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevated Photodiode with a Stacked Scheme
- Publication number 20150372042
- Publication date Dec 24, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Structure and Method
- Publication number 20150294955
- Publication date Oct 15, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevated Photodiodes with Crosstalk Isolation
- Publication number 20150118787
- Publication date Apr 30, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Image Sensor Packaging
- Publication number 20150118781
- Publication date Apr 30, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors with a High Fill-Factor
- Publication number 20150079718
- Publication date Mar 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevated Photodiode with a Stacked Scheme
- Publication number 20150064832
- Publication date Mar 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Image Sensor Packaging
- Publication number 20140231887
- Publication date Aug 21, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS Image Sensor Chips with Stacked Scheme and Methods for Forming...
- Publication number 20140042298
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS Image Sensor Chips with Stacked Scheme and Methods for Forming...
- Publication number 20140042299
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevated Photodiodes with Crosstalk Isolation
- Publication number 20140035082
- Publication date Feb 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Shin Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elevated Photodiode with a Stacked Scheme
- Publication number 20140035083
- Publication date Feb 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Hsun Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors with a High Fill-Factor
- Publication number 20130320194
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS

Meng-Hsun Wan

Person

Patents Grantslast 30 patents

Stacked semiconductor structure and method

Stacked semiconductor structure and method

Stacked semiconductor structure and method

Method and apparatus for image sensor packaging

Stacked semiconductor structure and method

Elevated photodiode with a stacked scheme

Method and apparatus for image sensor packaging

Stacked semiconductor structure and method

CMOS image sensor chips with stacked scheme and methods for forming...

Elevated photodiode with a stacked scheme

Stacked semicondcutor structure and method

Elevated photodiode with a stacked scheme

Forming pixel units of image sensors through bonding two chips

Elevated photodiodes with crosstalk isolation

Method and apparatus for image sensor packaging

Stacked semiconductor structure and method

Image sensors with a high fill-factor

Elevated photodiode with a stacked scheme

CMOS image sensor chips with stacked scheme and methods for forming...

Method and apparatus for image sensor packaging

Elevated photodiodes with crosstalk isolation

Elevated photodiode with a stacked scheme

Patents Applicationslast 30 patents

Stacked Semiconductor Structure and Method

Stacked Semiconductor Structure and Method

Stacked Semiconductor Structure and Method

Method and Apparatus for Image Sensor Packaging

Stacked Semiconductor Structure and Method

Elevated Photodiode with a Stacked Scheme

Stacked Semiconductor Structure and Method

Elevated Photodiode with a Stacked Scheme

Method and Apparatus for Image Sensor Packaging

Stacked Semicondcutor Structure and Method

Elevated Photodiode with a Stacked Scheme

Stacked Semiconductor Structure and Method

Elevated Photodiodes with Crosstalk Isolation

Method and Apparatus for Image Sensor Packaging

Image Sensors with a High Fill-Factor

Elevated Photodiode with a Stacked Scheme

Method and Apparatus for Image Sensor Packaging

CMOS Image Sensor Chips with Stacked Scheme and Methods for Forming...

CMOS Image Sensor Chips with Stacked Scheme and Methods for Forming...

Elevated Photodiodes with Crosstalk Isolation

Elevated Photodiode with a Stacked Scheme

Image Sensors with a High Fill-Factor