Meng-Hung Yeh

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding device and method of eliminating defective bonding wire
- Patent number 9,355,989
- Issue date May 31, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating wire bonding structure
- Patent number 9,289,846
- Issue date Mar 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING DEVICE AND METHOD OF ELIMINATING DEFECTIVE BONDING WIRE
- Publication number 20160079198
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING WIRE BONDING STRUCTURE
- Publication number 20150028081
- Publication date Jan 29, 2015
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140191393
- Publication date Jul 10, 2014
- Siliconware Precision Industries Co., Ltd.
- Lung-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS